AAEON will host live demonstrations of its portfolio of innovative vision solutions at Embedded World 2023 in Nuremberg between 14 – 16 March 2023. AAEON will also participate in two Embedded Forum discussions on the topic of Innovative Vision Solutions, outlining its approach to providing world-class multi-market solutions.
This Year’s Embedded Forum Discussions Include:
- Accelerating AI at the Edge: Go-to-Market Solutions with NVIDIA and AAEON – 14 March, 17:00 – 17:30 at Hall 2, Booth 2-510
AAEON’s PM Lead Ray Chang will be joined by Eddie Seymour, Embedded Business Development Director at NVIDIA, to explore how AAEON incorporates the latest NVIDIA technology to bring edge AI solutions to market.
- AI Vision at the Edge with MIPI-CSI2 Cameras on UP Squared Pro 7000 Powered by Intel SoC (formerly Alder Lake-N) – 15 March, 16:30 – 17:00 at Hall 3A, Booth 3A-631
Daniele Cleri, AI and IoT Software Architect at AAEON will be discussing the new UP Squared Pro 7000, and the promising market potential it possesses with its support for MIPI-CSI cameras.
With a diverse catalog of platforms designed to bring elite vision solutions to market in fields such as Industry 4.0, smart city, and intelligent healthcare; AAEON will showcase its portfolio of elite single board computers, systems, and developer boards. These demonstrations will feature a live demo of D3’s MIPI camera with the new UP Squared Pro 7000, as well as products featuring exciting new technologies from AAEON partners, such as the NVIDIA® Jetson Orin™ NX system-on-modules, the AMD Ryzen™ V2000 processors, and 13th Generation Intel® Core™ processors.
This Year’s Live Vision Solution Demonstrations Include:
- AAEON’s third generation of the UP Squared Pro series powered by Intel® Core™/Atom®/N-Series processors (formerly Alder Lake-N), the UP Squared Pro 7000, in action with D3 MIPI Cameras
- The UP Xtreme i11 Robotic Development Kit, showcasing a Robot Arm application
- Factory Digitalization demonstrations utilizing the SRG-APL, SRG-IMX8P and RTC-710AP from across AAEON’s IoT and Rugged Tablet range
- A Customer Service Center solution powered by the MIX-Q670A1, AAEON’s first product to host 13th Generation Intel® Core™ Processors, in Mini ITX Box PC form
- An Industry 4.0 4U Rack HPC with AAEON’s newest network server system with a 3rd Generation Intel® Xeon® Scalable CPU, the ZEUS-WHI0
- Automatic number-plate recognition solutions with the BOXER-8651AI Compact Fanless Embedded AI System featuring the NVIDIA Jetson Orin NX system-on-module
Also found at Booth 306, Hall 1 will be products from across AAEON’s diverse product lines, including the de next-V2K8, GENE-ADP6, and PICO-EHL4 from its award-winning SBC range. From its COM Express Module range, AAEON will display the new COM-ICDB7 and NANOCOM-EHL, while both newly released and upcoming Mini-ITX and ATX boards such as the ATX-Q670A and MAX-Q670A will also be on show.
From its system-level product range, AAEON will present an array of solutions from its renowned BOXER product line, comprising both the BOXER-6000 and BOXER 8000 series, powered by Intel® and NVIDIA technologies, respectively.
With the recent release of a number of new developer boards and edge systems, the newest generation of the UP product line will be showcased, with highlights such as the UP 4000, UP Element i12 Edge, and UP Squared Pro 7000 all debuting as the third generations of their respective product lines. Make sure to visit AAEON at Booth 306, Hall 1 of Embedded World 2023 in Nuremberg between 14 – 16 March 2023 to explore AAEON’s catalog of new products, and find out more about AAEON’s Innovative Vision Solutions at the Embedded Forum. Use the voucher code ew23492686 to book now.
