Electronics Era

  • About Us
  • Advertise with Us
  • Contact Us
  • e-Mag
  • Webinars
Header logo on website
Advertisement
Advertisement
Menu
  • News
    • Industry News
    • Product News
  • TECH ROOM
    • Sensor
    • VR / AR
    • Embedded
    • Medical Electronics
    • Industry 4.0
    • Robotic
    • Automation
    • Smart Machine
    • Component
    • Manufacturing
    • Aerospace & Defence
    • Security
    • Policy
  • Semiconductor
    • AUTOMOTIVE ELECTRONICS
      • EVs
      • HEVs
      • ADAS
      • Connected Cars
    • IoT-Internet of Things
      • Development Kit
      • IoT Design
    • Power Electronics
      • AC-DC/DC-DC Converters
      • Mosfets
      • IGBTs
      • LEDs
  • T & M
    • 5G testing
    • Oscilloscopes
    • SDN & NFV
    • RF & Wireless
  • AI/ML
  • Telecom
    • 5G/6G
  • RENEWABLES
    • Sustainability
  • Future Tech
    • Data Center
    • Cloud Computing
    • Big Data Analytics
  • Webinars
  • Editor’s Pick
    • Tech Article
    • Tech Blog
    • White Papers
    • EE-Tech Talk
    • Market Research
  • EE Awards
    • EE Awards 2025
    • EE Awards 2024
  • MORE
    • E-Mag
    • Events
    • Subscription
    • Contact Us
Home TECH ROOM Embedded

Latest Bluetooth Module from Panasonic Industry Now in Mass Production and Supporting Bluetooth 6.0

Great performance and minimal power consumption for Matter applications

Nimish by Nimish
August 26, 2025
in Embedded
Reading Time: 3 mins read
Panasonic Industry

Panasonic Industry Latest Bluetooth module the PAN B611

Share on FacebookShare on TwitterShare on LinkedIn

Munich – Now in mass production and offering great performance values and minimal power consumption for all Matter applications, the PAN B611-1 Bluetooth module from Panasonic Industry is based on the powerful Nordic nRF54L15 single chip controller. The product now also supports Bluetooth 6.0 and the cutting-edge Bluetooth Channel Sounding feature, enabling precise distance measurement and improved wireless communication. The PAN B611-1 had been initially announced as PAN B511-1 in February 2025.

All 32 pins available on nRF54L15 are routed out on to a hybrid packaging consisting of castellated edges and LGA in a hybrid layout such that a dedicated number of pins positioned at the edge lending for easy prototyping, with the rest of the GPIOs located at the bottom that allows leveraging the full potential of the wireless SoC platform. The module benefits from very small dimensions of only 10.35 mm × 9.8 mm × 1.9 mm. This way, it combines the advantages of both worlds without compromising on size and enables one of the best pin-to-size ratios for Bluetooth modules currently on the market. Its edge pins facilitate easier hand-soldering and support the use of inexpensive 2-layer PCB designs and optical inspection methods, eliminating the need for costly X-ray machines.

Based on nRF54L15, the module is shipped with an open embedded application processor based on ARM Cortex-M33 processor clocking up to 128 MHz for high performance embedded applications with a 256 kB RAM. Furthermore, the module has a non-volatile memory of 1.5 MB as available on the SoC.

However, Panasonic adds further features above and beyond those available on the SoC. Pascal Maier, Head of IOT Devices at Panasonic Industry comments: “Our latest PAN B611-1 Bluetooth module is a versatile device that can support a variety of applications – from ultra-low power battery driven solution to very complex applications like Matter, as well as sophisticated algorithm-heavy features like Channel Sounding. This is why we offer different spec variants to enable a variety of applications. The modules are for example available with additional integrated slow clock crystal for energy efficient battery powered operation and additional 4 MB Flash Memory for more complex applications. We think our clients will love this module for its versatility and power at a competitive price point.”

An output power of 8dbm makes the module ideally suited for the European market. The main target applications are lighting, home appliances, industrial sensors, medical devices, healthcare wearables and energy management devices and solar farms.

Furthermore, the PAN B611-1 is ideally suited for Matter applications, as dedicated variants exist with additional flash memory, and is fully compatible with the PAN MAX Service that facilitates the production and launch of Matter production. Apart from Matter, the highly versatile module also supports a variety of wireless protocols in the 2.4 GHz spectrum including Bluetooth LE, Bluetooth Mesh and IEEE 802.15.4 – enabling Zigbee and Thread as well as other third-party proprietary technologies, which make it effortless to develop products for smart home standards like Matter and Zigbee and even allow running multiple wireless protocols concurrently.

The PAN B611-1 Bluetooth module is available with an integrated chip antenna (-1C) or as bottom pad version (-1B) to cater to diverse project needs. It is certified for Europe (CE RED), UK (UKCA), USA (FCC), Canada (ISED), Japan (MIC).

For more information on the latest B611-1 Bluetooth module please click here.

Tags: Bluetooth 6.0Bluetooth ModulePAN B611-1Panasonic Industry
Nimish

Nimish

Join Our Newsletter

* indicates required
Electronics Era

Electronics Era, India's no.1 growing B2B news forum on Electronics and Cutting Edge Technology is exploring the editorial opportunity for organizations working in the Electronics Manufacturing Services(EMS) Industry.

Follow Us

Browse by Category

  • 5G testing
  • 5G/6G
  • AC-DC/DC-DC Converters
  • ADAS
  • Aerospace & Defence
  • AI/ML
  • Automation
  • AUTOMOTIVE ELECTRONICS
  • Big Data Analytics
  • Blockchain
  • Cloud Computing
  • Component
  • Connected Cars
  • Data Center
  • Editor's Desk
  • EE-Tech Talk
  • Electronics Components
  • Embedded
  • EVs
  • Future Tech
  • HEVs
  • Industry 4.0
  • Industry News
  • IoT-Internet of Things
  • LED & Lighting
  • LEDs
  • Manufacturing
  • Market Research
  • Medical Electronics
  • Mosfets
  • News
  • Oscilloscopes
  • Policy
  • Power Electronics
  • Product News
  • RENEWABLES
  • RF & Wireless
  • Robotic
  • SDN & NFV
  • Security
  • Semiconductor
  • Sensor
  • Smart Machine
  • SMT/PCB/EMS
  • Sustainability
  • T & M
  • Tech Article
  • Tech Blog
  • TECH ROOM
  • Telecom
  • Uncategorized
  • VR / AR
  • White Papers

Recent News

Ambiq

Ambiq Apollo510B Enhances Edge AI With Energy-Efficient Wireless Connectivity 

August 26, 2025
Cambridge GaN Devices (CGD)

CGD Announces Robin Lyle as VP R&D

August 26, 2025
  • About Us
  • Advertise with Us
  • Contact Us

© 2022-23 TechZone Print Media | All Rights Reserved

No Result
View All Result
  • News
    • Industry News
    • Product News
  • TECH ROOM
    • Sensor
    • VR / AR
    • Embedded
    • Medical Electronics
    • Industry 4.0
    • Robotic
    • Automation
    • Smart Machine
    • Component
    • Manufacturing
    • Aerospace & Defence
    • Security
    • Policy
  • Semiconductor
    • AUTOMOTIVE ELECTRONICS
      • EVs
      • HEVs
      • ADAS
      • Connected Cars
    • IoT-Internet of Things
      • Development Kit
      • IoT Design
    • Power Electronics
      • AC-DC/DC-DC Converters
      • Mosfets
      • IGBTs
      • LEDs
  • T & M
    • 5G testing
    • Oscilloscopes
    • SDN & NFV
    • RF & Wireless
  • AI/ML
  • Telecom
    • 5G/6G
  • RENEWABLES
    • Sustainability
  • Future Tech
    • Data Center
    • Cloud Computing
    • Big Data Analytics
  • Webinars
  • Editor’s Pick
    • Tech Article
    • Tech Blog
    • White Papers
    • EE-Tech Talk
    • Market Research
  • EE Awards
    • EE Awards 2025
    • EE Awards 2024
  • MORE
    • E-Mag
    • Events
    • Subscription
    • Contact Us

© 2022-23 TechZone Print Media | All Rights Reserved

Advertisement
Advertisement