Electronics Era

  • About Us
  • Advertise with Us
  • Contact Us
  • e-Mag
  • Webinars
Header logo on website
Advertisement
Advertisement
Menu
  • News
    • Industry News
    • Product News
  • TECH ROOM
    • Sensor
    • VR / AR
    • Embedded
    • Medical Electronics
    • Industry 4.0
    • Robotic
    • Automation
    • Smart Machine
    • Component
    • Manufacturing
    • Aerospace & Defence
    • Security
    • Policy
  • Semiconductor
    • AUTOMOTIVE ELECTRONICS
      • EVs
      • HEVs
      • ADAS
      • Connected Cars
    • IoT-Internet of Things
      • Development Kit
      • IoT Design
    • Power Electronics
      • AC-DC/DC-DC Converters
      • Mosfets
      • IGBTs
      • LEDs
  • T & M
    • 5G testing
    • Oscilloscopes
    • SDN & NFV
    • RF & Wireless
  • AI/ML
  • Telecom
    • 5G/6G
  • RENEWABLES
    • Sustainability
  • Future Tech
    • Data Center
    • Cloud Computing
    • Big Data Analytics
  • Webinars
  • Editor’s Pick
    • Tech Article
    • Tech Blog
    • White Papers
    • EE-Tech Talk
    • Market Research
  • EE Awards
    • EE Awards 2025
    • EE Awards 2024
  • MORE
    • E-Mag
    • Events
    • Subscription
    • Contact Us
Home News Product News

Molex Quad-Row Board-to-Board Connectors, Now at Mouser

Set New Standard in Space-Saving Connections

Editorial by Editorial
January 24, 2023
in Product News
Reading Time: 2 mins read
Molex Quad-Row Board-to-Board Connectors
Share on FacebookShare on TwitterShare on LinkedIn

Mouser Electronics, Inc., the industry’s leading New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic components™, is now stocking the Quad-Row board-to-board connectors from Molex. The Quad-Row board-to-board connectors feature a staggered circuit layout and a 0.175 mm pitch low-profile design for a 30% space savings over conventional connectors. These patent-pending connectors offer product developers and device manufacturers greater freedom and flexibility to support compact form factors, making them ideal for augmented reality/virtual reality (AR/VR), automotive, communications, IoT, medical and wearable applications.

The Quad-Row board-to-board connectors adhere to the 3.0 A current rating, enabling high power in a compact form factor. Additionally, the product aligns with the standard soldering pitch of 0.35mm to expedite volume manufacturing using typical surface mount technology (SMT) processes. Reliable, robust performance is assured, thanks to interior armor and insert-molded power nail, which safeguards pins from damage during volume manufacturing and assembly. These capabilities, along with a wide alignment, facilitate easy, secure mating and low fallout rates.

“Molex continually drives connectivity innovations in support of increasingly smaller yet more powerful devices,” said Justin Kerr, Vice President and General Manager, Micro Solutions Business Unit, Molex. “With the high-density, Quad-Row board-to-board connectors, our customers now can squeeze more features, sensors and functionality into increasingly tight spaces without compromising device performance. As a result, Molex is setting a new connectivity standard for space optimization.”

The Molex Quad-Row board-to-board connectors are available in 32- and 36-pin configurations with 20- and 64-pin configurations coming soon. Plans are underway to support up to 100-pin counts. Applications include smartphones, wearable devices, IoT and smart home devices, AR/VR devices, drones, patient monitoring systems, therapeutic and surgical equipment and more.

Tags: ARaugmented realityAutomotivecommunicationselectronic componentsIoTmedicalMolexQuad-Rowsemiconductorsvirtual realityVRwearable applications
Editorial

Editorial

Join Our Newsletter

* indicates required
Electronics Era

Electronics Era, India's no.1 growing B2B news forum on Electronics and Cutting Edge Technology is exploring the editorial opportunity for organizations working in the Electronics Manufacturing Services(EMS) Industry.

Follow Us

Browse by Category

  • 5G testing
  • 5G/6G
  • AC-DC/DC-DC Converters
  • ADAS
  • Aerospace & Defence
  • AI/ML
  • Automation
  • AUTOMOTIVE ELECTRONICS
  • Big Data Analytics
  • Blockchain
  • Cloud Computing
  • Component
  • Connected Cars
  • Data Center
  • Editor's Desk
  • EE-Tech Talk
  • Electronics Components
  • Embedded
  • EVs
  • Future Tech
  • HEVs
  • Industry 4.0
  • Industry News
  • IoT-Internet of Things
  • LED & Lighting
  • LEDs
  • Manufacturing
  • Market Research
  • Medical Electronics
  • Mosfets
  • News
  • Oscilloscopes
  • Policy
  • Power Electronics
  • Product News
  • RENEWABLES
  • RF & Wireless
  • Robotic
  • SDN & NFV
  • Security
  • Semiconductor
  • Sensor
  • Smart Machine
  • SMT/PCB/EMS
  • Sustainability
  • T & M
  • Tech Article
  • Tech Blog
  • TECH ROOM
  • Telecom
  • Uncategorized
  • VR / AR
  • White Papers

Recent News

QNU LaAB

QNu Labs Launches QNu Academy

June 26, 2025
ASDC Hosts Annual Partners Forum 2025: “Stronger Together, Transform Tomorrow”

Dr. Qureshi, Add Sec, MHI at ASDC Event

June 26, 2025
  • About Us
  • Advertise with Us
  • Contact Us

© 2022-23 TechZone Print Media | All Rights Reserved

No Result
View All Result
  • News
    • Industry News
    • Product News
  • TECH ROOM
    • Sensor
    • VR / AR
    • Embedded
    • Medical Electronics
    • Industry 4.0
    • Robotic
    • Automation
    • Smart Machine
    • Component
    • Manufacturing
    • Aerospace & Defence
    • Security
    • Policy
  • Semiconductor
    • AUTOMOTIVE ELECTRONICS
      • EVs
      • HEVs
      • ADAS
      • Connected Cars
    • IoT-Internet of Things
      • Development Kit
      • IoT Design
    • Power Electronics
      • AC-DC/DC-DC Converters
      • Mosfets
      • IGBTs
      • LEDs
  • T & M
    • 5G testing
    • Oscilloscopes
    • SDN & NFV
    • RF & Wireless
  • AI/ML
  • Telecom
    • 5G/6G
  • RENEWABLES
    • Sustainability
  • Future Tech
    • Data Center
    • Cloud Computing
    • Big Data Analytics
  • Webinars
  • Editor’s Pick
    • Tech Article
    • Tech Blog
    • White Papers
    • EE-Tech Talk
    • Market Research
  • EE Awards
    • EE Awards 2025
    • EE Awards 2024
  • MORE
    • E-Mag
    • Events
    • Subscription
    • Contact Us

© 2022-23 TechZone Print Media | All Rights Reserved

Advertisement
Advertisement