Shenzhen, China – MYIR has launched the MYC-LT527, a cost-effective System-on-Module (SoM) that is equipped with the Allwinner T527 AI platform SoC. This SoC delivers superior computing power with its Octa-core ARM Cortex-A55 CPU, up to 1.8GHz main frequency, and strong G57 MC1 GPU performance. For users with higher performance needs, the T527 supports up to 2 TOPs NPU, further enhancing AI computing capabilities.
The MYC-LT527 performs well in hardware configuration. It integrates 2GB/4GB LPDDR4, 16GB/32GB eMMC, 32Kbit EEPROM and power management IC (PMIC), and adopts 381-pin expansion interface design in LGA packaging, enabling the base board to carry the most I/O signals to and from the SOM, providing users with more flexible and powerful scalability. Compact in size at only 45mm by 43mm, the MYC-LT527 is ready to run Android operation system and suitable for a range of application scenarios, including high-performance industrial robots, energy and power, medical equipment, display and controller machines, edge board AI boxes, vehicle terminals and other embedded devices that require media and AI functionalities.
Features Of MYC-LT527 SOM
– Dimensions: 45mm x 43mm
– PCB Layers: 12-layer design
– Power supply: 5V/3A
– Working temperature: -40~85 Celsius (industrial grade) or -20~70 Celsius (extended temperature)
– OS support: Android 13
– Allwinner T527 processor
* Octa-core ARM Cortex-A55, up to 1.8GHz
* RISC-V CPU, up to 200 MHz
* 600MHz HIFI4 Audio DSP
* ARM G57 MC1 GPU
* Up to 2 Tops NPU
– 2GB LPDDR4 (supports optional 1GB / 4GB LPDDR4)
– 16GB eMMC (supports optional 8GB / 32GB eMMC)
– 32Kbit EEPROM
– Power Management IC
– 381-pin LGA Expansion Interfaces
* 2 x RGMII/RMII
* 1 x PCIe2.1, RC mode (reused with USB3.1)
* 1 x USB 2.0 DRD
* 1 x USB 2.0 Host
* 1 x USB 3.1 DRD (reused with PCIe2.1)
* 2 x SDIO 3.0
* 10 x UART
* 2 x CAN
* 9 x I2C
* 30 x PWM
* 4 x SPI
* 24 x GPADC, 12-bit
* 2 x LRADC, 6-bit
* 1 x Parallel CSI, 16-bit
* 1 x HDMI 2.0
* 1 x eDP
* 2 x LVDS with dual link- 2 x RGB
* 4+4-lane, 4+2+2-lane, or 2+2+2+2-lane MIPI-CSI
* 2 x MIPI-DSI
* 2 x DACs and 3 x ADCs
* 3 x audio outputs
* 3 x audio inputs
* 4 x I2S/PCM
* 1 x SPIF I/O
* 2 x CIR RX and 1 x CIR TX
* Up to 138 x GPIO
Note: the peripheral signals brought out to the expansion interface are listed in maximum number. Some signals are reused. Please refer to the processor datasheet and SOM pin-out description file.
MYIR offers the MYD-LT527 Development Board for evaluating the MYC-LT527. This board is assembled by soldering the MYC-LT527 SOM onto a base board, which serves as an expansion board tailor-made for using with the MYC-LT527 module. It is equipped with a comprehensive range of interfaces, including one USB3.0, two USB2.0, two Gigabit Ethernet, two CAN interfaces, a WiFi/Bluetooth module, a Micro SD card slot, an Audio interface, two Mini-CSI interfaces, and multiple display interfaces: HDMI, Mini-DP, MIPI-DSI and LVDS. It also features a 40-pin RPI-compatible expansion interface and a MYIR custom 40-pin expansion interface, MI Fans PI interface, for increased expandability. Additionally, MYIR offers optional MY-CAM003M Camera Module, MY-WIREDCOM RPI Module (RS232/RS485/CAN) and MY-LVDS070C LCD Module, which greatly enhance the functionality of the board.
| Part No. | LPDDR4 | eMMC | NPU | Working Temp. | Unit Price |
| MYC-LT527MN-32E4D-180-I-G | 4GB | 32GB | Support | -40~85 Celsius | $89 |
| MYC-LT527MN-16E2D-180-I-G | 2GB | 16GB | Support | -40~85 Celsius | $69 |
| MYC-LT527M-16E2D-180-I-G | 2GB | 16GB | Not Support | -40~85 Celsius | $55 |
| MYC-LT527M-16E2D-180-E | 2GB | 16GB | Not Support | -20~70 Celsius | $40 |
MYIR provides four standard configurations for the MYC-LT527 SOM to meet the different needs of the customers. The modules are affordable and we also offer discounts for bulk purchases.
More information about the MYC-LT527 SOM can be found at:
