Nuremberg, Embedded World 2025 – Panasonic Industry announces their cost-effective Wi-Fi® 6 & Bluetooth® LE Combo module series PAN W602, based on the Texas Instruments (TI) SimpleLink™ WiFi® CC3301 companion IC and CC3351 Companion IC.
The PAN W602 will be available in a single band (PAN W602-1) and dual-band variant (PAN W602-2) and will be equipped with an integrated antenna for easy hardware design and easy end-certification. Alternatively, Panasonic Industry also offers a variant with available bottom pad for applications that require an external antenna.
The module series is suitable for low-cost Wi-Fi 6 applications that require low data rates, for example inverters, medical devices, heat pumps, or EV chargers.
TI’s CC3301 and CC3351 devices stand out in particular with Wi-Fi 6 and Bluetooth LE 5.4 support at an affordable price. They feature robust security, including WPA3 and firmware authentication capabilities. The versatile architecture of these chipsets allows seamless integration with processors running Linux/Android or capable microcontrollers (MCU) running RTOS and networking stack, addressing a wide range of industrial and Internet of Things (IoT) applications that require affordable, secure and reliable wireless communication.
Tomislav Tipura, Product Manager at Panasonic Industry comments: “We are proud to continue our decade-long collaboration with Texas Instruments, and we are excited to introduce this new module series, built on their advanced CC3301 and CC3351 chipsets. This collaboration allows us to deliver high-performance solutions that meet the evolving needs of our customers at a competitive price point.”
“In today’s fast-paced IoT landscape, companies designing innovative Wi-Fi 6-enabled applications are focused on reducing time to market for new products while keeping costs low. The PAN W602 family of modules from Panasonic, based on our SimpleLink wireless products, are helping to meet this need, and expand the capabilities of Wi-Fi and cloud-based ecosystems. We look forward to seeing these modules further unlock the potential of our increasingly connected world.” adds Shmulik Elgavi, Product Line Manager, Wi-Fi Connectivity Solutions at Texas Instruments.
The PAN W602 Series Wi-Fi 6 and Bluetooth module will be certified for CE RED, FCC, ISED, MIC, and NZ/AUS. Samples are already available now and the start of mass production is scheduled for end of year 2025.
Curious to experience the module in action and see it in real life? Visit the Panasonic booth at Embedded World 2025 in Nuremberg, Germany, from March 11th to 13th, located in Hall 4A, Stand 103.
For more information on the latest PAN W602 module series please click here. For more information on TI’s Wi-Fi 6 offering please click here.
