Electronics Era

  • About Us
  • Advertise with Us
  • Contact Us
  • e-Mag
  • Webinars
Header logo on website
Advertisement
Advertisement
Menu
  • News
    • Industry News
    • Product News
  • TECH ROOM
    • Sensor
    • VR / AR
    • Embedded
    • Medical Electronics
    • Industry 4.0
    • Robotic
    • Automation
    • Smart Machine
    • Component
    • Manufacturing
    • Aerospace & Defence
    • Security
    • Policy
  • Semiconductor
    • AUTOMOTIVE ELECTRONICS
      • EVs
      • HEVs
      • ADAS
      • Connected Cars
    • IoT-Internet of Things
      • Development Kit
      • IoT Design
    • Power Electronics
      • AC-DC/DC-DC Converters
      • Mosfets
      • IGBTs
      • LEDs
  • T & M
    • 5G testing
    • Oscilloscopes
    • SDN & NFV
    • RF & Wireless
  • AI/ML
  • Telecom
    • 5G/6G
  • RENEWABLES
    • Sustainability
  • Future Tech
    • Data Center
    • Cloud Computing
    • Big Data Analytics
  • Webinars
  • Editor’s Pick
    • Tech Article
    • Tech Blog
    • White Papers
    • EE-Tech Talk
    • Market Research
  • EE Awards
    • EE Awards 2025
    • EE Awards 2024
  • MORE
    • E-Mag
    • Events
    • Subscription
    • Contact Us
Home TECH ROOM Robotic

Roborock Uses Hybrid ToF System by Infineon and Pmdtechnologies

Editorial by Editorial
September 5, 2024
in Robotic
Reading Time: 2 mins read
Roborock Qrevo Slim
Share on FacebookShare on TwitterShare on LinkedIn

Munich, Germany – Roborock has launched the intelligent sweeping and mopping all-in-one robot Roborock Qrevo Slim at IFA 2024 in Berlin, equipped with an innovative 3D camera module for navigation and obstacle avoidance using the REAL3™ Time-of-Flight (ToF) imager by Infineon Technologies (FSE: IFX / OTCQX: IFNNY). The technology allows to reduce size and increase reliability. Compared to the body height of traditional sweeping and mopping robots of around 100 mm, the overall height of the Roborock Qrevo Slim is only 82 mm, allowing it to pass through lower and narrower spaces while providing high reliability.

infineon pmd hybrid tof imager

“The integration of our REAL3 ToF into Roborock’s cleaning robot is a great example of how Infineon technology is used to accelerate product innovation in the smart home sector,” said Andreas Kopetz, Vice President Ambient Sensing at Infineon. “Our hybrid ToF solution targets a rapidly growing consumer robotic market, enabling customers to develop unique robot designs while reducing system costs and complexity.”

Roborock has teamed up with Infineon, pmdtechnologies and OMS to develop a next generation robot solution that uses hybrid Time-of-Flight (hToF) to replace the traditional laser distance scanner (LDS) module and obstacle avoidance module. hToF is a combination of Infineon’s REAL3 ToF imager, a dual infra-red illumination sources and pmd’s processing technology to provide a powerful solution for consumer-grade robots. It supports simultaneous localization and map building (SLAM), obstacle avoidance and cliff detection functions in one camera module manufactured by OMS.

“At pmd, we are proud to have played a leading role in the development and optimization of the hybrid Time-of-Flight (hToF) system that powers Roborock’s latest innovation. By contributing our advanced 3D pixels, our expertise in infra-red illumination, and our processing technology into the hToF module, we’ve been able to create a highly efficient, compact solution that significantly enhances navigation and obstacle avoidance capabilities,” said Jochen Penne, Managing Director at pmdtechnologies ag.

The high-resolution depth and vision data is perfectly suited for robust obstacle avoidance algorithms while the open-source SLAM algorithm based on hToF depth data generates high-precision maps, ensuring accurate and reliable navigation. In addition, hToF is working in darkness and strong sunlight. It is computationally efficient and streamlined, requiring e.g. only one Cortex A55 processor core for depth processing and SLAM computation tasks out of eight available cores.

Roborock has pioneered the mass production of LDS technology since 2016 and is promoting it as the standard configuration for sweeping robots. The company is the first to use the hybrid Time-of-Flight system in their new generation of sweeping robots.

Availability

Further information on the REAL3 ToF imager solution from Infineon is available at: www.infineon.com/ToFconsumer.

Tags: PmdtechnologiesRoborockRobotRobotics
Editorial

Editorial

Join Our Newsletter

* indicates required
Electronics Era

Electronics Era, India's no.1 growing B2B news forum on Electronics and Cutting Edge Technology is exploring the editorial opportunity for organizations working in the Electronics Manufacturing Services(EMS) Industry.

Follow Us

Browse by Category

  • 5G testing
  • 5G/6G
  • AC-DC/DC-DC Converters
  • ADAS
  • Aerospace & Defence
  • AI/ML
  • Automation
  • AUTOMOTIVE ELECTRONICS
  • Big Data Analytics
  • Blockchain
  • Cloud Computing
  • Component
  • Connected Cars
  • Data Center
  • Editor's Desk
  • EE-Tech Talk
  • Electronics Components
  • Embedded
  • EVs
  • Future Tech
  • HEVs
  • Industry 4.0
  • Industry News
  • IoT-Internet of Things
  • LED & Lighting
  • LEDs
  • Manufacturing
  • Market Research
  • Medical Electronics
  • Mosfets
  • News
  • Oscilloscopes
  • Policy
  • Power Electronics
  • Product News
  • RENEWABLES
  • RF & Wireless
  • Robotic
  • SDN & NFV
  • Security
  • Semiconductor
  • Sensor
  • Smart Machine
  • SMT/PCB/EMS
  • Sustainability
  • T & M
  • Tech Article
  • Tech Blog
  • TECH ROOM
  • Telecom
  • Uncategorized
  • VR / AR
  • White Papers

Recent News

Allied Market Research

Software Defined Vehicles: Future of Mobility and Transportation

May 31, 2025
Solitaire

Solitaire Launches PTK-208 PTZ Camera to Elevate Video Conferencing

May 31, 2025
  • About Us
  • Advertise with Us
  • Contact Us

© 2022-23 TechZone Print Media | All Rights Reserved

No Result
View All Result
  • News
    • Industry News
    • Product News
  • TECH ROOM
    • Sensor
    • VR / AR
    • Embedded
    • Medical Electronics
    • Industry 4.0
    • Robotic
    • Automation
    • Smart Machine
    • Component
    • Manufacturing
    • Aerospace & Defence
    • Security
    • Policy
  • Semiconductor
    • AUTOMOTIVE ELECTRONICS
      • EVs
      • HEVs
      • ADAS
      • Connected Cars
    • IoT-Internet of Things
      • Development Kit
      • IoT Design
    • Power Electronics
      • AC-DC/DC-DC Converters
      • Mosfets
      • IGBTs
      • LEDs
  • T & M
    • 5G testing
    • Oscilloscopes
    • SDN & NFV
    • RF & Wireless
  • AI/ML
  • Telecom
    • 5G/6G
  • RENEWABLES
    • Sustainability
  • Future Tech
    • Data Center
    • Cloud Computing
    • Big Data Analytics
  • Webinars
  • Editor’s Pick
    • Tech Article
    • Tech Blog
    • White Papers
    • EE-Tech Talk
    • Market Research
  • EE Awards
    • EE Awards 2025
    • EE Awards 2024
  • MORE
    • E-Mag
    • Events
    • Subscription
    • Contact Us

© 2022-23 TechZone Print Media | All Rights Reserved

Advertisement
Advertisement