Electronics Era

  • About Us
  • Advertise with Us
  • Contact Us
  • e-Mag
  • Webinars
Header logo on website
Advertisement
Advertisement
Menu
  • News
    • Industry News
    • Product News
  • TECH ROOM
    • Sensor
    • VR / AR
    • Embedded
    • Medical Electronics
    • Industry 4.0
    • Robotic
    • Automation
    • Smart Machine
    • Component
    • Manufacturing
    • Aerospace & Defence
    • Security
    • Policy
  • Semiconductor
    • AUTOMOTIVE ELECTRONICS
      • EVs
      • HEVs
      • ADAS
      • Connected Cars
    • IoT-Internet of Things
      • Development Kit
      • IoT Design
    • Power Electronics
      • AC-DC/DC-DC Converters
      • Mosfets
      • IGBTs
      • LEDs
  • T & M
    • 5G testing
    • Oscilloscopes
    • SDN & NFV
    • RF & Wireless
  • AI/ML
  • Telecom
    • 5G/6G
  • RENEWABLES
    • Sustainability
  • Future Tech
    • Data Center
    • Cloud Computing
    • Big Data Analytics
  • Webinars
  • Editor’s Pick
    • Tech Article
    • Tech Blog
    • White Papers
    • EE-Tech Talk
    • Market Research
  • EE Awards
    • EE Awards 2025
    • EE Awards 2024
  • MORE
    • E-Mag
    • Events
    • Subscription
    • Contact Us
Home Semiconductor

ROHM Launched 2nd Generation MUS-IC Series Audio DAC Chip

Delivers an authentic listening experience by expressing the three elements of spatial reverberation, quietness, and dynamic range while preserving the natural “texture” of musical instruments

Editorial by Editorial
January 22, 2025
in Semiconductor
Reading Time: 5 mins read
ROHM
Share on FacebookShare on TwitterShare on LinkedIn

ROHM has developed the 32-bit D/A converter IC (DAC chip) and evaluation board designed for flagship models in the MUS-IC™ series optimized for high-resolution audio playback.

Engineered to maximally extract and accurately convert high-resolution sound data to analog, DAC chips are crucial for determining audio equipment quality. ROHM leverages over 50 years of expertise in audio IC development to establish superior sound quality design technology, offering products such as high-fidelity sound processors and high-quality audio power ICs.

ROHM’s latest product builds on the 1st generation MUS-IC™ BD34301EKV audio DAC chip, renowned for its sound quality and widely adopted in high-end models from various companies. The BD34302EKV inherits the core design concept behind ROHM’s DAC chip — natural flat sound — and, by adding the three elements of spatial reverberation, quietness, and dynamic range from the MUS-IC™ series to authentically reproduce the “texture” of musical instruments for an even more realistic audio experience.

By incorporating a new algorithm for Data Weighted Averaging (DWA), the BD34302EKV achieves a THD+N characteristic of -117dB (THD: -127dB), a key performance indicator that enhances sound quality by achieving a sound quality that conveys a realistic sense of texture. At the same time, the signal-to-noise ratio (SNR) of 130dB provides noise performance befitting a flagship DAC chip, while a sampling frequency of up to 1,536kHz allows customers to fully leverage the high-precision calculations of their digital signal processors (DSPs).

In monaural mode, which allocates one DAC chip per channel, ROHM’s proprietary HD (High Definition) monaural mode contributes to smoother, more natural sound. As part of the MUS-IC™ series, uncompromising craftsmanship has been applied down to the smallest details. Based on years of expertise in sound quality design, the optimal bonding wire material for each terminal of the BD34302EKV was selected to accurately convey the natural “texture” of musical instruments. These features help create the ideal sound sought by high-end audio manufacturers.

MUS-IC™ Series DAC Chip Lineup

Online Sales Information

Availability: NowOnline Distributors: DigiKey™, Mouser™, and Farnell™

The products will be offered at other online distributors as they become available.

  • Applicable Part No: BD34302EKV
  • Evaluation Board Part No: BD34302EKV-EVK-001

MUS-IC™ — ROHM’s Highest Grade Audio ICs

Created by combining the “sound quality design technology” with ROHM’s company mission of “Quality First”, “vertically integrated production system”, and “contribution to the musical culture”, MUS-IC™ (official name: ROHM Musical Device “MUS-IC™”) is an audio device brand that represents the ultimate IC solutions developed by ROHM’s team of experienced and dedicated engineers. For more information, please visit ROHM’s Musical Device “MUS-IC™” web page. https://micro.rohm.com/en/mus-ic

*MUS-IC™ is a trademark or registered trademark of ROHM Co., Ltd.

Terminology

High Resolution Audio Source

High-resolution audio sources, often called “hi-res audio,” typically use a sampling frequency of 96kHz or higher and a bit depth of 24 bits or more. In comparison, standard CD-quality audio is played back at a 44.1kHz sampling frequency with 16-bit depth. This means hi-res audio provides significantly more data resolution and dynamic range than standard CD-quality audio, resulting in superior sound quality.

DWA (Data Weighted Averaging)

Technology that improves audio characteristics by balancing mismatches between elements when operating multiple switching components for analog conversion.

THD+N (Total Harmonic Distortion + Noise)

A key performance metric for audio equipment that measures the ratio of harmonics to the fundamental wave. Indicates how accurately the waveform is reproduced — the smaller the value the more faithful the reproduction.

HD (High Definition) Monaural Mode

ROHM’s proprietary digital signal processing technology that improves bit (amplitude) resolution. This allows for improvements in numerical performance while enhancing sound quality to deliver smooth audio that reveals the texture of musical instruments.

DigiKey™, Mouser™ and Farnell™ are trademarks or registered trademarks of their respective companies

Tags: Audio DAC ChipBD34301EKVMUS-IC SeriesROHM
Editorial

Editorial

Join Our Newsletter

* indicates required
Electronics Era

Electronics Era, India's no.1 growing B2B news forum on Electronics and Cutting Edge Technology is exploring the editorial opportunity for organizations working in the Electronics Manufacturing Services(EMS) Industry.

Follow Us

Browse by Category

  • 5G testing
  • 5G/6G
  • AC-DC/DC-DC Converters
  • ADAS
  • Aerospace & Defence
  • AI/ML
  • Automation
  • AUTOMOTIVE ELECTRONICS
  • Big Data Analytics
  • Blockchain
  • Cloud Computing
  • Component
  • Connected Cars
  • Data Center
  • Editor's Desk
  • EE-Tech Talk
  • Electronics Components
  • Embedded
  • EVs
  • Future Tech
  • HEVs
  • Industry 4.0
  • Industry News
  • IoT-Internet of Things
  • LED & Lighting
  • LEDs
  • Manufacturing
  • Market Research
  • Medical Electronics
  • Mosfets
  • News
  • Oscilloscopes
  • Policy
  • Power Electronics
  • Product News
  • RENEWABLES
  • RF & Wireless
  • Robotic
  • SDN & NFV
  • Security
  • Semiconductor
  • Sensor
  • Smart Machine
  • SMT/PCB/EMS
  • Sustainability
  • T & M
  • Tech Article
  • Tech Blog
  • TECH ROOM
  • Telecom
  • Uncategorized
  • VR / AR
  • White Papers

Recent News

SEMI Southeast Asia

SEMI Southeast Asia Appoints Dato’ Bock KL, Sandisk, as New Regional Advisory Board Chairman

July 16, 2025
Strangeworks

Strangeworks Expands Global Presence to India, Srilanka and the Middle East

July 16, 2025
  • About Us
  • Advertise with Us
  • Contact Us

© 2022-23 TechZone Print Media | All Rights Reserved

No Result
View All Result
  • News
    • Industry News
    • Product News
  • TECH ROOM
    • Sensor
    • VR / AR
    • Embedded
    • Medical Electronics
    • Industry 4.0
    • Robotic
    • Automation
    • Smart Machine
    • Component
    • Manufacturing
    • Aerospace & Defence
    • Security
    • Policy
  • Semiconductor
    • AUTOMOTIVE ELECTRONICS
      • EVs
      • HEVs
      • ADAS
      • Connected Cars
    • IoT-Internet of Things
      • Development Kit
      • IoT Design
    • Power Electronics
      • AC-DC/DC-DC Converters
      • Mosfets
      • IGBTs
      • LEDs
  • T & M
    • 5G testing
    • Oscilloscopes
    • SDN & NFV
    • RF & Wireless
  • AI/ML
  • Telecom
    • 5G/6G
  • RENEWABLES
    • Sustainability
  • Future Tech
    • Data Center
    • Cloud Computing
    • Big Data Analytics
  • Webinars
  • Editor’s Pick
    • Tech Article
    • Tech Blog
    • White Papers
    • EE-Tech Talk
    • Market Research
  • EE Awards
    • EE Awards 2025
    • EE Awards 2024
  • MORE
    • E-Mag
    • Events
    • Subscription
    • Contact Us

© 2022-23 TechZone Print Media | All Rights Reserved

Advertisement
Advertisement