Haverhill, MA – October 2025 – Seica Inc., a global leader in supplying high-technology, innovative test solutions to the electronics industry, is pleased to announce two new solutions dedicated to the testing of power and mixed-signal semiconductors. These solutions will be showcased at the upcoming SEMICON West Exhibition & Conference, taking place from October 7-9 in Phoenix, Arizona at Booth 5756, where visitors can also explore Seica’s specialized solutions for testing MEMS, wafers and other products of the semiconductor industry.
S20 IS³
The S20 IS³ system offers a leading-edge solution for testing discrete power devices, including SiC and GaN technologies. Designed for both AC-Dynamic and DC-Static testing, the Seica solution performs accurate and repeatable characterization of electrical parameters, a crucial process to ensure the reliability and performance of components such as IGBTs, MOSFETs, and diodes, making it an essential tool for production, quality control and R&D.
Static tests measure key parameters such as on-state voltage (Vce, Vds), leakage current (Ic, Id), and threshold voltage (Vth), ensuring the device meets its electrical specifications. Dynamic tests evaluate switching characteristics, including turn-on/off times, rise/fall times, and energy losses, which are critical for real-world applications. By testing both static and dynamic parameters, manufacturers can detect potential failures before the components are integrated into power systems, thereby avoiding costly field failures while certifying that your devices will perform optimally under specified operating conditions.
The S20 IS³ component, module and wafer test system hardware architecture is designed and manufactured using SiC and GaN devices to ensure high accuracy and low noise testing of your power devices and modules, system thermal performance reliability and valuable system power efficiency combining low cost of ownership with a minimal floor space requirement.
The advanced measurement system of the S20 IS³ can perform high power precision measurements, provide reliable and repeatable results, and have a compact, space-saving design with one-box integration of DC-Static, AC-Dynamic testing. The system is configurable, so the user can include the modules to perform the tests you need today, and expandable, allowing more modules to be added to meet new test requirements and parallelism needs for increased UPH (units/hour). The integrated high-level, menu-driven software is user-friendly, making for easy test setup, and a series of features, such as the integrated oscilloscope, facilitate the debug process, and provide full traceability of the test results.
S20 RTH
The S20 RTH test system is designed to deliver precise thermal resistance (RTH) characterization with advanced power and cooling management capabilities. Among all semiconductor devices, transistors are by far the most important category and nearly all of them are three-pin devices (MOSFETs, BJTs, IGBTs) and, unlike diodes, they have a driving section which makes them more sensitive to issues related to the interaction between power handling and the input signal. In modern power supply design, increased attention is given to the electrical efficiency of the overall system and to the junction temperature of semiconductor devices, and this kind of test evaluates the thermal stress on power MOSFET devices when they are used in switch mode power supplies. By this computation and with the physical characteristics of the device, it is possible to predict the temperature reached inside the junction, and the allowable margin or heatsink required to assure that the system has a suitable thermal margin during operation. This approach is fundamental because correct computation allows for a more accurate evaluation of component/device lifetime and assures working operation within the Safe Operating Area.
The S20 RTH can safely handle high current loads (standard configuration is 1200A @15V or 30V), ensuring accurate thermal performance evaluation under real operating conditions.
Seica’s power switching hardware is a key element of the test architecture, enabling a programmable controlled shutdown of the load current which minimizes oscillations, allowing the system to perform precise measurements as soon as 80µs after the high current shutdown. The configuration of the bench is scalable, starting from 2 Devices Under Test (DUTs)up to 12 DUTs tested in parallel, depending on throughput needs. The temperature, flow and pressure of the coolant to each DUT is automatically measured and controlled by the system, optimizing thermal stability and ensuring reliable measurements. Purging cooling liquids is handled by the system either into a stand-alone reservoir or into your plant wide system. This feature greatly simplifies initial setup operations, and can handle temperatures of up to 120°C and flow rates up to 100 l/min.
Both the S20 IS³ and S20 RTH communicate and send all test measurements and binning data via industry wide standards. Due to Seica’s extensive software capabilities we can work together with the end user to meet any unique requirements.
Come visit us at Booth 5756 to see how our innovation can help accelerate yours!
