DRESDEN, Germany — The SEMI 3D & Systems Summit, taking place from 12-14 June, 2024 in Dresden, will feature the forefront of technological integration. Themed Heterogeneous Systems for the Intelligently Connected Era, the summit will unravel the intricate web of collaboration among components driving the next wave of innovation. From artificial intelligence algorithms to sensor data processing, attendees will deep dive into the dynamic framework enabling decision-making and real-time applications in an increasingly connected world. Registration is open.
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“SEMI Europe looks forward to welcoming leading experts in Dresden. With exceptional speakers and a brand-new exhibition, the Summit offers insights into cutting-edge heterogeneous integration innovations essential for semiconductor applications, driving the advancement of intelligent systems,” said Laith Altimime, President of SEMI Europe.
This year’s SEMI 3D & Systems Summit will present a broad scope of topics including:
- AI as a Driver to Grow 3D Technology Implementation
- Accelerating the AI Economy through Heterogeneous Integration
- Heterogeneous Integration for Photonics Applications
- Technology and Market Updates for 2.5D & 3D Packaging for Heterogeneous Integration
- Design and Technologies of Chiplet System Architectures
- Hybrid Bonding Technologies for Advanced 3D Integration
- Manufacturing Innovation for 3D Integration
Featured Speakers
- Bill Chen, ASE Fellow & Senior Technical Advisor, ASE, Inc.
- Carlos Lee, Director General, EPIC
- Dirk Hilbert, Mayor, City of Dresden
- E. Jan Vardaman, President, TechSearch International, Inc.
- Frank Bösenberg, Managing Director, Silicon Saxony
- Kurt Herremans, Program Director Automotive Chiplets, imec
- Isabel Obieta, Programme Manager for Sustainable Semiconductors, EISMEA
- Liron Gantz, Manager of the Electro-Optics Group, NVIDIA
- Ming Zhang, VP of R&D, PDF Solutions
- Serge Nicoleau, Group VP of Technology, STMicroelectronics
- Seung Kang, Senior VP of Semiconductor Strategy, Adeia
Global Leaders to Present
3D & Systems Summit presenters include experts from global leaders:
- Adeia
- ANSYS, Inc.
- ASE, Inc.
- CEA-Leti
- Comet Yxlon
- EPIC
- European Commission
- EV Group
- Fraunhofer IZM
- HEIDENHAIN
- imec
- KLA Corporation
- Lam Research
- MKS-Atotech
- NVIDIA
- PDF Solutions
- Siemens EDA
- Silicon Saxony
- SPTS Technologies
- STMicroelectronics
- SUSS MicroTec
- TechSearch International, Inc.
- Tokyo Electron Limited
- Yole Group
Networking
This year’s networking reception will take place at the Hilton Dresden on the first day of the event, and the annual networking dinner will be held on the Elbe River cruise on the second day of the summit.
Networking Dinner Cruise registration is reserved exclusively for 3D & Systems Summit 2024 participants. Guests may register their spouse for dinner by completing the spouse registration form.
Exhibition
The most prominent names in 3D integration microelectronics manufacturing will showcase their latest products and technologies at the new exhibition area. Exhibitors include: Adeia, ASE Inc., ASMPT AMICRA, Besi, CEA-Leti, Comet Yxlon, Confovis, European Chips Diversity Alliance, European Chips Skills Academy, EV Group, Fraunhofer IZM-ASSID, HEIDENHAIN, HiCONNECTS, Lam Research, ProSys, Renishaw, SET Corporation, Tokyo Electron Limited and Wooptix.
To reserve an exhibition space, contact euevents@semi.org.
3D Summit Premium Sponsors
- Platinum: Adeia,ASE, Inc., Comet Yxlon, Heidenhain, KLA Corporation, and Lam Research
- Event: EV Group, Evatec, imec, MKS-Atotech and Tokyo Electron Limited
For more details, please visit the 3D & Systems Summit 2024 website and connect with SEMI Europe onX or LinkedIn @SEMIEurope (#3DSummit).
