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Home Future Tech

SmartDV Redoubles Focus on Customer Experience and IP Your Way

New structure for application engineering organization facilitates user support, IP deployment

Nimish by Nimish
February 24, 2024
in Future Tech
Reading Time: 2 mins read
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SAN JOSE, Calif. — SmartDV™ Technologies, provider of flexible, highly configurable, customizable semiconductor design IP (intellectual property) and verification IP, is taking a fresh look at IP deployment and customer support under the leadership of Vice President of Application Engineering Sergio Marchese.

In an industry where off-the-shelf IP cores are ubiquitous, the additional flexibility of SmartDV’s “IP Your Way” is attractive to customers who need to customize IP to meet their unique chip design needs. Customization necessitates a deeper customer-supplier relationship than is typical in the IP space, and SmartDV quickly saw the need for a streamlined process for specifying projects, delivering IP, and supporting users.

SmartDV’s application engineers (AEs) support customers throughout the entire engagement lifecycle: from IP evaluation and configuration, through to customization considerations, delivery, and silicon bring-up. The engagement follows a well-defined, documented process that allows for the flexibility of requirement changes (common in most projects); interfaces between the user and the research and development team designing the IP; and ensures predictability and transparency.

As VP of application engineering, Sergio Marchese is creating a new team and shifting the focus from IP deliverables to IP consumables—guiding the deployment of tools and processes that put the experience of both customers and SmartDV employees at the center. “SmartDV’s AEs are on a mission to make fast, friendly, expert support a reality for every IP user,” Marchese proclaimed. ”We are the customer’s arm inside SmartDV. We aim to be their trusted advisor, to deeply understand their project needs and expectations, and to ensure that they can leverage the IP that SmartDV provides to make their chip designs successful. The changes we have put in place over the past two years, coupled with robust plans for expanding our team, have set us on the right path to achieve these goals.”

Nimish

Nimish

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