LiDAR Rides China’s Wave
OUTLINE The global LiDAR market for automotive is expected to grow to US$3,632 million in 2029 at a 38% CAGR ...
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Tag: Automotive
STMicroelectronics Introduced 36V Operational Amplifiers in Industrial and Automotive Grades
STMicroelectronics has introduced the TSB952 dual operational amplifier (op amp) with 52MHz gain-bandwidth and supply current of just 3.3mA per channel at 36V, ...
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Navigating the Future: Trends Shaping India’s Automotive Landscape
The automotive industry is undergoing a transformative shift, driven by technological advancements, changing consumer preferences, and stringent regulatory requirements. In ...
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Automotive High Voltage eFuse/eDisconnect and Solid-State Switches
The supply and the wiring harness of a high-power source must be protected against overload conditions and short circuits, as ...
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Infineon Expanding its Portfolio of Next-Generation OptiMOS 7 MOSFETs for Automotive Applications
Munich, Germany – Infineon Technologies AG is expanding its portfolio of next-generation OptiMOS™ 7 MOSFETs for automotive applications: the portfolio ...
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An Exclusive Interaction with Sebastian AnanthaSwamy, Continental Automotive, India
Electronics Era: Explore the role of AI in driving the growth of Automobile Manufacturing & its impact on automotive industries? ...
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ASDC Showcased Future Automotive Talent at India Skills
New Delhi – The Automotive Skill Development Council (ASDC) proudly marks its presence at India Skills 2024, a premier national ...
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ST Introduced Automotive-Qualified Step-Down Synchronous DC/DC Converters that Save Space and Ease Integration
STMicroelectronics has introduced new automotive-qualified step-down synchronous DC/DC converters that save space and ease integration in applications including body electronics, audio ...
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Infineon Unveils XENSIV TLE49SR Angle Sensor Family with Outstanding Stray Field Robustness
Munich, Germany – Infineon Technologies AG introduces the new XENSIV™ TLE49SR angle sensor family, which combines excellent stray field immunity ...
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Honda and IBM Sign MoU to Explore Joint R&D of Semiconductor Chip and Software Technologies for Future SDV
TOKYO, Japan / ARMONK, N.Y., U.S.A.- Honda has announced that Honda and IBM have signed a Memorandum of Understanding (MOU) outlining ...
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Electronics Era, India's no.1 growing B2B news forum on Electronics and Cutting Edge Technology is exploring the editorial opportunity for organizations working in the Electronics Manufacturing Services(EMS) Industry.
