Renesas Announced Wi-Fi Development Kit for New Matter Protocol
Renesas Electronics Corporation has announced its first development kit that includes support for the new Matter protocol. Renesas also announced ...
Read moreRenesas Electronics Corporation has announced its first development kit that includes support for the new Matter protocol. Renesas also announced ...
Read moreMade using cutting-edge technology, Matrix COSEC ATOM RD200 satisfies all the access control requirements present across the markets. Maintaining an ...
Read moreMALVERN, Pa. — Vishay Intertechnology today introduced a new series of surface-mount multilayer ceramic chip capacitors (MLCC) optimized for DC blocking ...
Read moreMouser Electronics, is now stocking the BL5340 multi-core multi-protocol Bluetooth modules from Laird Connectivity. Featuring the Nordic Semiconductor nRF5340 system-on-chip ...
Read moreIn its “EA DEMOPACKs”, DISPLAY VISIONS is bundling the 2.8-inch uniTFT displays with a variety of additional modules including touch ...
Read moreVANCOUVER : Quectel Wireless Solutions has announced its advanced 5G modules — which securely and reliably connect devices and people to ...
Read moreQualcomm Technologies announced new RFFE modules targeted for best-in-class Wi-Fi and Bluetooth experiences. The expanded portfolio is designed for Bluetooth, ...
Read moreTOKYO, Japan ―Renesas Electronics Corporation has announced the SmartBond DA1470x Family of Bluetooth low energy (LE) solutions―the world’s most advanced, ...
Read moreMunich, Germany – Infineon Technologies AG is adding the AIROC CYW20820 Bluetooth & Bluetooth LE (low energy) system on chip ...
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