Congatec Introduces 3.5-inch Application Carrier Board for COM-HPC Mini Modules
Taipei City, Taiwan - congatec – a leading provider of embedded and edge computing technology – presents the first board-level ...
Read moreTaipei City, Taiwan - congatec – a leading provider of embedded and edge computing technology – presents the first board-level ...
Read moreWAKEFIELD, Mass - PICMG, a leading consortium for developing open embedded computing specifications, has announced the release of the COM-HPC 1.2 ...
Read morecongatec will be presenting its comprehensive COM-HPC ecosystem at embedded world 2023 (hall 3 / booth 241). The portfolio now ...
Read morecongatec announces the availability of COM-HPC and COM Express Computer-on-Modules based on high-end 13th Gen Intel Core processors in BGA ...
Read morecongatec is pleased to announce that the PICMG COM-HPC technical subcommittee has approved the pinout and footprint of the new ...
Read morePICMG announced that the COM-HPC committee has finalized the pinout and dimension definitions for the COM-HPC Mini form factor in ...
Read moreWAKEFIELD :. PICMG has announced major extensions to the COM-HPC Computer-on-Module (COM) standard with the ratification of COM-HPC 1.15 for ...
Read moreFREMONT, CA, UNITED STATES - American Portwell Technology has announced PCOM-B800GT, the latest addition to its computer-on-module (COM) family. According to ...
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