Bring it on: High performance in a mini form factor
At embedded world, congatec will be presenting first modules based on the preliminary COM-HPC Mini specification. And since modules alone ...
Read moreAt embedded world, congatec will be presenting first modules based on the preliminary COM-HPC Mini specification. And since modules alone ...
Read morecongatec is pleased to announce that it is expanding its strategic solutions portfolio in the Arm processor sector to include ...
Read moreThe two German embedded and edge computing heavyweights, congatec and Kontron, have concluded a cooperation agreement to standardize the design ...
Read morecongatec will be presenting its enhanced high-performance landscape for edge computing at Automation World Korea (hall C, booth 534). This ...
Read morecongatec – a leading vendor of embedded and edge computing technology – announces the launch of a new carrier board ...
Read morecongatec announces the availability of COM-HPC and COM Express Computer-on-Modules based on high-end 13th Gen Intel Core processors in BGA ...
Read morecongatec is pleased to announce that the PICMG COM-HPC technical subcommittee has approved the pinout and footprint of the new ...
Read morecongatec – a leading vendor of embedded and edge computing technology – welcomes the ratification of the COM Express 3.1 ...
Read morecongatec – a leading vendor of embedded and edge computing technology – introduces its new ecosystem for TSN aimed at ...
Read moreDeggendorf, Germany- congatec has received the Platinum Vendor Satisfaction Award for IoT & Embedded Hardware technology from VDC Research. The deciding ...
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