ROHM Developed New High Power Density SiC Power Modules
ROHM has developed the new 4-in-1 and 6-in-1 SiC molded modules in the HSDIP20 package optimized for PFC and LLC ...
Read moreROHM has developed the new 4-in-1 and 6-in-1 SiC molded modules in the HSDIP20 package optimized for PFC and LLC ...
Read moreTORRANCE, CA – Navitas Semiconductor, the only pure-play, next-generation power semiconductor company and industry leader in gallium nitride (GaN) power ICs ...
Read moreMunich, Germany– Infineon Technologies AG, global semiconductor leader in power systems and IoT, launched the next generation of high-density power ...
Read moreAndover, Mass. – Vicor has released three automotive-grade power modules for 48V EV systems which deliver industry-leading power density and ...
Read moreMunich, Germany, Long Beach, California – Artificial Intelligence is currently driving an exponential increase in global data generation, and consequently ...
Read moreAndover, MA – Vicor Corporation, the leader in high‑performance power modules, speaks with VideoRay, a leading manufacturer of underwater remote ...
Read moreSTMicroelectronics has released the ACEPACK 1DMT-32 family of silicon carbide (SiC) power modules in a convenient 32-pin, dual-inline, molded, through-hole package for automotive ...
Read moreVicor’s Powering Innovation podcast examines how a global leader in ocean wave energy systems is powering offshore applications using power ...
Read moreHeraeus Electronics and Robert Bosch GmbH have signed a patent and know-how license agreement at the PCIM Europe exhibition in ...
Read moreTUCSON, Arizona, U.S.A. – Apex Microtechnology has announced the release of the SA111, the latest addition to their line of ...
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