ROHM launches New Top-Side Cooling Package for SiC MOSFETs
ROHM has developed the TSC3PAK (14.00 × 18.58 × 3.50mm) package for SiC MOSFETs. By adopting a top-side heat dissipation ...
Read moreROHM has developed the TSC3PAK (14.00 × 18.58 × 3.50mm) package for SiC MOSFETs. By adopting a top-side heat dissipation ...
Read moreROHM Co., Ltd. has announced that its 750 V SiC MOSFET has been adopted in a BBU (Battery Backup Unit) ...
Read moreROHM has released the ROHM PLECS Simulator on ROHM’s official website. This simulation tool enables designers of power electronics circuits ...
Read moreROHM has developed new Electro-Static Discharge (ESD) protection diodes – the RESDxVx series – that achieve both industry-leading low dynamic ...
Read moreROHM has developed a wireless power supply IC chipset consisting of the receiver - ML7670 - and transmitter - ML7671 ...
Read moreROHM has developed the latest device of its EcoSiC™ series: the 5th Generation SiC MOSFETs optimized for high‑efficiency power applications. ...
Read moreROHM has added the new CMOS Operational Amplifier (op amp) series “TLRx728” and “BD728x” to its lineup. These are suitable ...
Read moreROHM has released reference designs "REF68005", "REF68006", and "REF68004" for three-phase inverter circuits featuring EcoSiC™ brand SiC molded modules "HSDIP20", ...
Read moreROHM Co., Ltd. and Suchi Semicon Pvt. Ltd. are pleased to announce the establishment of a strategic semiconductor manufacturing partnership ...
Read moreROHM Co., Ltd. has decided to integrate its own development and manufacturing technologies for GaN power devices with the process ...
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