NeoCortec exhibiting at Embedded World 2023
NeoCortec is exhibiting at Embedded World in Nuremberg, Germany from 14th to 16th March 2023 in Hall 3 Stand 526. ...
Read moreNeoCortec is exhibiting at Embedded World in Nuremberg, Germany from 14th to 16th March 2023 in Hall 3 Stand 526. ...
Read moreMaxLinear announced a key partnership with Airgain, Inc. to develop a reference design for Massive MIMO Radio Units (RU) with improved ...
Read moreNeoCortec, manufacturer of ultra-low-power bi-directional wireless mesh network modules, has signed a new distribution agreement with service-oriented special distributor, Endrich ...
Read moreAnritsu Corporation (President Hirokazu Hamada) has announced a strategic partnership with Spirent Communications in Open RAN*1Â test solutions. This collaboration will ...
Read moreFujitsu has announced the launch of a new 5G vRAN solution combining Fujitsu's virtualized CU (vCU) and virtualized DU (vDU) ...
Read moreNEC Corporation has developed a power amplifier that will serve as a key device for mobile access and fronthaul/backhaul wireless ...
Read moreTDK Corporation nnounced the TDK i3 Micro Module, the world’s first module with built-in edge AI and wireless mesh connectivity ...
Read moreRemcom announces a new version of Wireless InSite® 3D Wireless Prediction Software with propagation analysis for engineered electromagnetic surfaces, allowing modeling of passive ...
Read moreDue to the constantly growing popularity of devices equipped with wireless communication modules, constructors more and more often look for ...
Read moreElectronica, Munich : NeoCortec is releasing its new P Series of wireless NeoMesh modules at Electronica in Munich from 15th ...
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