Electronics Era

  • About Us
  • Advertise with Us
  • Contact Us
  • e-Mag
  • Webinars
Header logo on website
Advertisement
Advertisement
Menu
  • News
    • Industry News
    • Product News
  • TECH ROOM
    • Sensor
    • VR / AR
    • Embedded
    • Medical Electronics
    • Industry 4.0
    • Robotic
    • Automation
    • Smart Machine
    • Component
    • Manufacturing
    • Aerospace & Defence
    • Security
    • Policy
  • Semiconductor
    • AUTOMOTIVE ELECTRONICS
      • EVs
      • HEVs
      • ADAS
      • Connected Cars
    • IoT-Internet of Things
      • Development Kit
      • IoT Design
    • Power Electronics
      • AC-DC/DC-DC Converters
      • Mosfets
      • IGBTs
      • LEDs
  • T & M
    • 5G testing
    • Oscilloscopes
    • SDN & NFV
    • RF & Wireless
  • AI/ML
  • Telecom
    • 5G/6G
  • RENEWABLES
    • Sustainability
  • Future Tech
    • Data Center
    • Cloud Computing
    • Big Data Analytics
  • Webinars
  • Editor’s Pick
    • Tech Article
    • Tech Blog
    • White Papers
    • EE-Tech Talk
    • Market Research
  • EE Awards
    • EE Awards 2025
    • EE Awards 2024
  • MORE
    • E-Mag
    • Events
    • Subscription
    • Contact Us
Home News Product News

Tetra to Extend its PAM4 Technology to Space

Editorial by Editorial
January 28, 2023
in Product News
Reading Time: 2 mins read
pam4space
Share on FacebookShare on TwitterShare on LinkedIn

Data traffic within satellites, launchers and space stations is constantly growing as, for example, sensors and camera resolutions increase from generation to generation. Thus, new, faster, and more efficient (in terms of energy per transmitted bit) intra-satellite data transmission is required.

We are proud to announce that Tetra Semiconductors has been selected by ESA to develop a next-generation optical communication interface for intra satellite communications.

In recent years Tetra Semiconductors has developed chipsets compliant with the emerging 400Gbit/s Ethernet standards for the next generation of large data centers and ethernet switches. Tetra Semiconductors’ unique analog circuit architecture is capable of receiving, recovering and decoding multilevel signals and not only provides a competitive advantage with regards to power consumption, robustness and chip size, but is also very well suited for the radiation-hardened versions necessary for space applications. For these reasons, Tetra Semiconductors was asked to adapt its current 400Gbit/s Ethernet product TS2 for use in the space industry. On top of Tetra’s new CDR approach, the company has longstanding experience in designing optical frontends for obtaining the best possible link budget. These link margins are hard requirements in satellite communications as they extend the temperature range and operational lifetime of the products in space, where radiation accelerates ageing.

The target is to develop two derivatives of Tetra’s existing TS2 chipset, both for 53 Gbit/s per channel VCSEL-based interconnects. One derivative will contain radiation-hardened versions of the linear optical front-ends (without a CDR) optimized for the lowest possible power consumption targeted for use in short intra-satellite links. The other derivative of the TS2 will include both radiation-hardened optical front-ends and CDRs for longer link applications such as those seen in launchers or larger satellites.

With the development of these two chipsets, Tetra and ESA have partnered to increase the optical bandwidth in satellite systems while reducing power consumption, both increasingly crucial to the space industry.

Tetra Semiconductos acknowledges the support of and excellent collaboration with ESA and the Swiss Space office.

Tags: analog circuitPAM4 Technologysatellite communicationsSpaceTetra Semiconductors
Editorial

Editorial

Join Our Newsletter

* indicates required
Electronics Era

Electronics Era, India's no.1 growing B2B news forum on Electronics and Cutting Edge Technology is exploring the editorial opportunity for organizations working in the Electronics Manufacturing Services(EMS) Industry.

Follow Us

Browse by Category

  • 5G testing
  • 5G/6G
  • AC-DC/DC-DC Converters
  • ADAS
  • Aerospace & Defence
  • AI/ML
  • Automation
  • AUTOMOTIVE ELECTRONICS
  • Big Data Analytics
  • Blockchain
  • Cloud Computing
  • Component
  • Connected Cars
  • Data Center
  • Editor's Desk
  • EE-Tech Talk
  • Electronics Components
  • Embedded
  • EVs
  • Future Tech
  • HEVs
  • Industry 4.0
  • Industry News
  • IoT-Internet of Things
  • LED & Lighting
  • LEDs
  • Manufacturing
  • Market Research
  • Medical Electronics
  • Mosfets
  • News
  • Oscilloscopes
  • Policy
  • Power Electronics
  • Product News
  • RENEWABLES
  • RF & Wireless
  • Robotic
  • SDN & NFV
  • Security
  • Semiconductor
  • Sensor
  • Smart Machine
  • SMT/PCB/EMS
  • Sustainability
  • T & M
  • Tech Article
  • Tech Blog
  • TECH ROOM
  • Telecom
  • Uncategorized
  • VR / AR
  • White Papers

Recent News

Global Electronics Association.

IPC Rebrands as Global Electronics Association

June 30, 2025
Fujitsu Japan Limited

The University of Osaka and Fujitsu Japan Launch Joint Research on AI-Powered Education Support 

June 30, 2025
  • About Us
  • Advertise with Us
  • Contact Us

© 2022-23 TechZone Print Media | All Rights Reserved

No Result
View All Result
  • News
    • Industry News
    • Product News
  • TECH ROOM
    • Sensor
    • VR / AR
    • Embedded
    • Medical Electronics
    • Industry 4.0
    • Robotic
    • Automation
    • Smart Machine
    • Component
    • Manufacturing
    • Aerospace & Defence
    • Security
    • Policy
  • Semiconductor
    • AUTOMOTIVE ELECTRONICS
      • EVs
      • HEVs
      • ADAS
      • Connected Cars
    • IoT-Internet of Things
      • Development Kit
      • IoT Design
    • Power Electronics
      • AC-DC/DC-DC Converters
      • Mosfets
      • IGBTs
      • LEDs
  • T & M
    • 5G testing
    • Oscilloscopes
    • SDN & NFV
    • RF & Wireless
  • AI/ML
  • Telecom
    • 5G/6G
  • RENEWABLES
    • Sustainability
  • Future Tech
    • Data Center
    • Cloud Computing
    • Big Data Analytics
  • Webinars
  • Editor’s Pick
    • Tech Article
    • Tech Blog
    • White Papers
    • EE-Tech Talk
    • Market Research
  • EE Awards
    • EE Awards 2025
    • EE Awards 2024
  • MORE
    • E-Mag
    • Events
    • Subscription
    • Contact Us

© 2022-23 TechZone Print Media | All Rights Reserved

Advertisement
Advertisement