Taipei, Taiwan – Test Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, proudly introduces the new TR7500 SIII Ultra. The new Multi Camera AOI solution features advanced inspection technology, delivering industry-leading speed and precision for electronics manufacturing.
The new AOI TR7500 SIII Ultra features Multi-Angle Side View inspection with four side-angled cameras and one top camera for full coverage defect detection. The side view cameras allow the platform to inspect inner layer bridges, hidden lifted leads, and other out-of-sight defects. The TR7500 SIII Ultra also supports optional capabilities such as AI-powered inspection, Metrology-grade measurements, and 3D laser imaging to enhance accuracy and coverage.
Built on the same high-precision platform as TRI’s flagship TR7700Q SII, the TR7500 SIII Ultra enhances mechanical performance with Ballscrew Z-axis control and an AC Servo Motion Controller. The structural design has also been significantly upgraded. Compared to its predecessor’s welded steel frame, the TR7500 SIII Ultra is built on a vibration-resistant cast iron base that provides superior rigidity and inspection stability. The system supports PCB weights up to 3 kg, with optional configurations for 5 kg and 12 kg.
The TR7500 SIII Ultra supports current Smart Factory and communication standards, including SMEMA, SECS/GEM, IPC-CFX-2591, and IPC-HERMES-9852, ensuring a cost-effective, Industry 4.0-compliant solution for comprehensive defect detection and data exchange.
For more information about the TR7500 SIII Ultra, please visit the link below,
https://www.tri.com.tw/en/product/product_detail-11-2-1844.html
