LYON, France – The AP market will have a 10.6% CAGR between 2022 and 2028 to US$78.6 billion. In contrast, the traditional packaging market is projected to have a slower 3.2% CAGR from 2022 to 2028, with a US$57.5 billion market value at the end of the period. Overall, the packaging market is forecasted to grow at a CAGR of 6.9% to $136 billion.
In its new annual Status of the Advanced Packaging Industry 2023 report, Yole Intelligence, part of Yole Group, forecasts that the AP market accounted for approximately 47% of the total IC packaging market in 2022. Its share is steadily increasing due to various megatrends. Within the AP market, the Flip-Chip platform, which includes FCBGA and FCCSP , held a 51% market share in 2022. The segments expected to have the highest revenue CAGR from 2022 to 2028 are ED , 2.5D/3D, and flip-chip, with growth rates of 30%, 19%, and 8.5%, respectively.
According to Bilal Hachemi, Ph.D., Technology and Market Analyst Packaging within the Semiconductor, Memory, and Computing Division at Yole Intelligence, part of Yole Group: “Mobile & consumer represented 70% of the total AP market in 2022. This segment is projected to have a 7% CAGR from 2022 to 2028, constituting 61% of the AP revenue by 2028. The telecom & infrastructure segment is the fastest growing, with an estimated revenue growth rate of around 17%. Automotive & transportation will make up 9% of the market, while other segments like medical, industrial, and aerospace/defense will account for 3%.”
Although traditional packaging currently dominates wafer production with nearly 71% of the total output in 2022, the AP market is gradually increasing its share…
To read the full story, please click: Advanced semiconductor packaging: A new geopolitical battleground
