ROHM Developed New High Power Density SiC Power Modules
ROHM has developed the new 4-in-1 and 6-in-1 SiC molded modules in the HSDIP20 package optimized for PFC and LLC ...
Read moreROHM has developed the new 4-in-1 and 6-in-1 SiC molded modules in the HSDIP20 package optimized for PFC and LLC ...
Read moreMunich, Germany – Infineon Technologies AG and Marelli, a world-leading automotive systems manufacturer, are partnering to advance automotive display technology ...
Read moreShanghai – NOVOSENSE Microelectronics, a semiconductor company specializing in high-performance analog and mixed-signal chips, has announced the launch of the NSUC1500-Q1, a highly ...
Read moreNOVOSENSE Microelectronics has announced the launch of the NSUC1500-Q1, a highly integrated System-on-Chip (SoC) designed to meet the demands of ...
Read morePhotonic integrated circuits are the optical equivalent of microchips, using semiconductor industry processes to shrink many photonic components down onto ...
Read moreOMNIVISION launched its new OV50X CMOS image sensor with the mobile phone industry’s highest dynamic range, for movie-grade video capture. ...
Read moreTata Electronics Private Limited announced the appointment of KC Ang as President and Head of its Foundry business - Tata ...
Read moreNavitas Semiconductor has announced its GaNSense power ICs will power GreatWall’s latest 2.5kW ultra-high power density DC-DC converter for AI ...
Read moreTOKYO, Japan― Renesas Electronics Corporation has introduced a new industry-leading Bluetooth chip that combines a radio transceiver, an Arm® M0+ ...
Read moreSTMicroelectronics has been named in the Top 100 Global Innovators 2025. The annual list from Clarivate, a leading global provider of transformative ...
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