Indium Corporation‘s Evan Griffith, product specialist for semiconductor and advanced assembly materials, will host a webinar about the fundamentals of flip-chip bonding at 10 a.m. New York, Thursday, Sept. 15, as part of the company’s webinar program—the InSIDER Series.
Flip-chip bonding technology has a long history, stemming from its inception by General Electric in Indium Corporation’s hometown of Utica, New York, U.S. As such, the term “flip-chip” has evolved to encompass a wide variety of bonding technologies that solve various bonding challenges. In the most basic sense of the term, flip-chip bonding defines the bonding process in which the circuitry of a chip is manufactured face-down and flipped to be attached to a substrate.
In Flip-Chip 101, the history of flip-chip technology and the trends that have caused the manufacturing process to evolve will be discussed. Common failure modes in flip-chip assembly will also be touched on, as well as how material advancements have allowed for and will continue to push new technology in flip-chip bonding.
You may register for Griffith’s webinar at: indium.news/flip-chip101. The webinar link will be shared with registrants the day of the event. Registrants must use a company email account to avoid Indium Corporation’s spam filters. This is a first-come, first-served event.
Griffith is a product specialist for SEMI/SAAM fluxes and SiPaste materials. He is based at Indium Corporation’s global headquarters. He is responsible for researching and analyzing customer and market data, and facilitating current and prospective customers’ needs. Additionally, he supports customers’ inquiries, internal product trainings, and works closely with Indium Corporation’s R&D team on new applications. He earned his Bachelor of Engineering degree in Materials Science, graduating with honors, and his Master of Engineering Management degree from the Thayer School of Engineering at Dartmouth College, Hanover, N.H., U.S. He has also earned his Six Sigma Green Belt.
