BARCELONA — HARMAN Embedded Audio (HEA), a leading end‑to‑end B2B embedded audio solutions provider, announced it will showcase how global brands can differentiate connected devices through premium embedded audio and seamless connectivity at Mobile World Congress (MWC), taking place from March 2–5 at Fira Gran Via in Barcelona.
Located in Hall 2 at the HARMAN Automotive booth (#2D51), HEA will demonstrate how its integrated hardware and software solutions help partners across the connectivity ecosystem deliver more intuitive human-centered experiences. Through live demonstrations and partner products, HEA will highlight how audio can elevate performance and strengthen brand identity across connected devices.
Leading the HEA team at MWC are Ruomu Hu, Vice President and General Manager of HARMAN Embedded Audio, and Paul McCambridge, Director of Sales for EMEA. Their attendance highlights HEA’s strategic focus on the entire connectivity value chain, from semiconductor leaders to mobility innovators.
“MWC is the ultimate stage for the connectivity ecosystem, and the scale of this 20th-anniversary show provides an exciting opportunity to connect with our partner brands,” said Hu. “We are focused on meeting with potential partners who share our vision of precise design, collaboration, and innovation. We aren’t just delivering audio, we are providing the acoustic fidelity and brand equity that help our partners turn digital interactions into meaningful, human experiences.”
At the show, HEA will showcase the versatility of embedded technologies across a range of partner products spanning computing, mobile, personal protective equipment, and active lifestyle markets. These products offer a firsthand look at how HEA collaborates with partners to develop integrated hardware and software systems that enable accelerated development cycles and deliver elevated consumer experiences.
For more information on HEA and its solutions, visit embedded.harman.com, its newly redesigned website, providing partners with a clearer view into its integrated hardware and software capabilities, technical resources, and co-branding solutions.
