Infineon Announced XENSIV™ sensors drive smart solutions
Munich– Infineon Technologies AG has announced it plans to showcase smart sensing applications that make life easier, safer and greener...
Munich– Infineon Technologies AG has announced it plans to showcase smart sensing applications that make life easier, safer and greener...
SIP or horizontal mount formatInput 6 – 15 VOutput 0.6 – 5 VParallelable up to four unitsPMBus® Flex Power Modules...
Munich– Innovative car cockpits, seamless connectivity with new services and improved passive safety: 3D depth sensors play a key role...
Munich, Germany – Infineon Technologies AG is adding the AIROC CYW20820 Bluetooth & Bluetooth LE (low energy) system on chip...
TOKYO - Olympus Corporation has announces that from April 2022, the company has begun to exclusively source 100% of the electricity...
e-peas will be using this year’s Embedded World exhibition to showcase the breadth of applications empowered by its technology as well...
TOKYO- Lendlease and Princeton Digital Group (PDG) today marked the commencement of construction of a 100 MW data center campus...
Mouser Electronics is now stocking the reComputer Jetson 20-1 Xavier NX and reComputer Jetson 10-1 Nano development kits from Seeed Studio. Built with advanced NVIDIA...
MALVERN, Pa.— Vishay Intertechnology has introduced a new low profile, AEC-Q200 qualified DC-Link metallized polypropylene film capacitor. Designed to meet...
Tokyo, Japan― Renesas Electronics Corporation has announced it has entered into a definitive agreement with Reality Analytics, Inc. (Reality AI), a leading provider of embedded...
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