TEC Signed MoU with IIIT-Hyderabad
The Telecommunication Engineering Centre (TEC), the technical arm of the Department of Telecommunications (DoT), Government of India, has signed a...
The Telecommunication Engineering Centre (TEC), the technical arm of the Department of Telecommunications (DoT), Government of India, has signed a...
The Department of Telecommunications (DoT) has organised an insightful webinar on 24th October 2025 to promote a culture of cyber...
Students today are growing up in a world that demands interactivity, personalization and instant feedback. Traditional classrooms often struggle to...
In the vast stretches of India’s countryside, where tractors till the soil and pumps irrigate the land, a silent revolution...
Taipei, Taiwan- Leading provider of industrial PC solutions AAEON, has introduced the BOXER-6649-RAP, the company’s first fanless embedded computer equipped...
Hong Kong– CITIC Telecom International CPC Limited is pleased to announce its innovative and intelligent solution Auto-Op has won the...
MALVERN, Pa. — Vishay Intertechnology, has introduced a new series of insulated, surface-mount inrush current limiting positive temperature coefficient (PTC)...
TOKYO, Japan ― Renesas Electronics Corporation has introduced the RA8M2 and RA8D2 microcontroller (MCU) groups. Based on a 1 GHz Arm® Cortex®-M85 processor with...
ROHM has developed an innovative Schottky barrier diode that overcomes the traditional VF / IR trade-off. This way, it delivers...
Andover, Mass– Vicor Corporation Intellectual Property (IP) stemming from Vicor’s development of high-density power system technology is key to performance...
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