LYON, France – November 21st, 2025 |Yole Group announces the release of its new technology & market report, Glass Materials for Semiconductor Manufacturing 2025, a comprehensive study analyzing the rapid rise of glass as a strategic material in semiconductor processes and permanent device architectures.
Through a consolidated analysis of multiple end markets, including CIS, MEMS, RF, power devices, memory/HBM, AR/VR, and microfluidics, Yole Group’s report details the technological evolution, market expansion, and supply-chain transformation expected through 2030. Yole Group’s objective is to guide material suppliers, equipment vendors, foundries, OSATs, and system integrators as they navigate the emerging opportunities and constraints associated with the adoption of glass.
Bilal Hachemi, PhD, Senior Technology & Market Analyst, Semiconductor Packaging at Yole Group: “Glass is transitioning from a specialty material to a foundational process platform. Its adoption is accelerating across carriers, wafer-level optics, interposers, power devices, and memory packaging. It is driven by higher integration, 3D architectures, and advanced manufacturing requirements.”
Glass is rapidly becoming one of the semiconductor industry’s most strategic materials. With demand set to triple, applications diversifying, and supply chains transforming, stakeholders must prepare for a decade defined by capacity scaling, finishing capabilities, equipment interdependence, and cost-per-cycle management.
Yole Group invites the semiconductor community to explore the complete findings of the Glass Materials for Semiconductor Manufacturing 2025 report…
