PIC100 technology in 300 mm high-volume production for leading hyperscalers, with plans to quadruple capacity by 2027 and further expand...

ROHM has begun online sales of new SiC molded modules: TRCDRIVE pack™, HSDIP20 and DOT-247. Amid growing concerns over tightening...

AUSTIN — Ambiq Micro, Inc., a technology leader in ultra-low power semiconductor solutions for edge AI, today announced it has won the 2026 Embedded...

Fynd, a leading AI-native retail technology company backed by Reliance Retail Ventures Limited,today announced the launch of ‘Vibe with Fynd’,...

Waldenburg (Germany), Wrocław (Poland) – Würth Elektronik and embedded systems developer Grinn announce their collaboration at embedded world 2026. The...

TORRANCE, CA –  Navitas Semiconductor, an industry leader in next-generation GaNFast™ gallium nitride (GaN) and GeneSiC™ silicon carbide (SiC) power...

OpenLight, a leader in heterogeneous III‑V silicon photonic integration and custom Photonic Application‑Specific Integrated Circuits (PASICs), will showcase multiple technology...

Panasonic Industry announces the release of FineX (“FineCross”), a next‑generation transparent conductive film engineered for high‑performance electromagnetic wave shielding in advanced or...

First open end-to-end electronics development platform unites device exploration, model-based system development, device lifecycle management and early concept validation in...

See SIMCom at Embedded World on Booth 3-525, Messe Nürnberg, Nuremburg, Germany, March 10-12 2026 SIMCom, a leading provider of...