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Home Semiconductor

Caliber Interconnects Leverages Cadence Tools to Accelerate High-Performance, First-Time-Right Designs

Nimish by Nimish
November 13, 2025
in Semiconductor
Reading Time: 2 mins read
Caliber Interconnects

Caliber Interconnects Leverages Cadence Tools

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Coimbatore, India — Caliber Interconnects Pvt. Ltd., a semiconductor design house specializing in advanced packaging and high-density PCB design, today announced it has achieved accelerated turnaround times and first-time-right outcomes for complex chiplet and Automated Test Equipment (ATE) hardware projects. The company has refined its proprietary design and verification workflow, which integrates powerful Cadence solutions to optimize performance, power, and reliability from the earliest stages of design.

Caliber’s advanced methodology significantly enhances the efficiency and precision of designing high-complexity IC packages and dense PCB layouts. By leveraging the Cadence Allegro X Design Platform for PCB and advanced package designs, which features sub-drawing management and auto-routing, Caliber’s teams can work in parallel across various circuit blocks, compressing overall project timelines by up to 80 percent. This streamlined framework is reinforced by a rigorous in-house verification process and custom automation utilities developed using the Allegro X Design Platform’s SKILL-based scripting, ensuring consistent quality and compliance with design rules.

To meet the demands of next-generation interconnects operating at over 100 Gbps, Caliber’s engineers utilize Cadence’s Sigrity X PowerSI and Sigrity X PowerDC solutions. These advanced simulation tools allow the team to analyze critical factors such as signal loss, crosstalk, and power delivery network (PDN) impedance. By thoroughly evaluating IR drop, current density, and Joule heating, Caliber can confidently deliver design signoff, reducing the risk of costly respins and speeding time to market for its customers.

“Our team has elevated our engineering leadership by creating a disciplined workflow that delivers exceptional quality and faster turnaround times for our customers across the semiconductor ecosystem,” said Suresh Babu, CEO of Caliber Interconnects. “Integrating Cadence’s advanced design and simulation environment into our proprietary methodology empowers us to push the boundaries of performance and reliability in complex chiplet and ATE hardware design.”

By combining its deep design expertise with state-of-the-art Cadence solutions, Caliber enables customers to reduce design risks and bring next-generation semiconductor systems to market with greater speed and confidence.

Tags: Automated Test Equipment (ATE)Cadence Allegro XCaliber Interconnects
Nimish

Nimish


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