TOKYO, Japan ― Renesas Electronics Corporation has announced that it has developed circuit technologies for an embedded spin-transfer torque magnetoresistive random-access...
Read moreTOKYO, Japan ― Renesas Electronics Corporation has announced two new cloud development kits, CK-RA6M5 and CK-RX65N, providing a complete connectivity solution...
Read moreSIP or horizontal mount formatInput 6 – 15 VOutput 0.6 – 5 VParallelable up to four unitsPMBus® Flex Power Modules...
Read moreMunich– Innovative car cockpits, seamless connectivity with new services and improved passive safety: 3D depth sensors play a key role...
Read moreMunich, Germany – Infineon Technologies AG is adding the AIROC CYW20820 Bluetooth & Bluetooth LE (low energy) system on chip...
Read moreMALVERN, Pa.— Vishay Intertechnology has introduced a new low profile, AEC-Q200 qualified DC-Link metallized polypropylene film capacitor. Designed to meet...
Read moreMunich, Germany – Infineon Technologies AG has announced plans to highlight how it links the real to the digital world...
Read moreMALVERN, Pa. — Vishay Intertechnology has introduced a new series of surface-mount TRANSZORB bidirectional transient voltage suppressors (TVS) in the SMC (DO-214AB)...
Read moreThalwil, Switzerland – u-blox has announced the u-blox LARA-L6 LTE Cat 4 cellular module. The smallest of its kind to offer truly...
Read moreThalwil, Switzerland – u-blox has announced the u-blox XPLR-IOT-1 IoT explorer kit, an all-in-one package to test, evaluate and validate IoT applications....
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