Voi, Europe’s leading micro mobility provider, is teaming up with Biliti Electric, an electric three-wheeler manufacturing company, to become the...
Read moreVishay Intertechnology has introduced a new Automotive Grade series of vPolyTanâ„¢ surface-mount polymer tantalum molded chip capacitors. Designed to deliver...
Read moreQualcomm Technologies has announced that the premium Snapdragon® 8 Gen 2 Mobile Platform for Galaxy is powering Samsung Electronics Co., Ltd.’s latest...
Read moreDanisense, the leader in high-accuracy current sense transducers for demanding applications, today announced the release of its latest current transducer...
Read morePacking a 30W rating into a 25.4mm x 25.4mm low-profile case, the new cost-effective REC30E-Z series of DC/DC converters from RECOM also...
Read moreHydrogen Vehicle Systems (HVS), a UK-based hydrogen-powered commercial vehicle innovator, today reveals that the consortium it leads, Hub2Hub, has been...
Read moreNordic Semiconductor today announces the availability of the nRF7002â„¢ Wi-Fi 6 companion IC and its associated nRF7002 Development Kit (DK)....
Read moreElektrobit has announced a new generation of its EB corbos Starter Kit that provides carmakers and Tier 1 suppliers with software...
Read moreDiodes Incorporated has announced the release of its first Silicon Carbide (SiC) Schottky barrier diodes (SBD). The portfolio includes the...
Read moreTetra Semiconductors Ltd. proudly announces their 4-channel CDR chip TSC2PAM designed to replace DSPs in existing 8-channel 400Gb Ethernet optical...
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