Semiconductor
From Wafer to Panel: How Lam Is Building the Future of Advanced Packaging
Key takeaways: Panel-level packaging enables higher area efficiency and scalability for large-format advanced packages Transitioning from wafer to panel introduces...
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Microchip Technology Announced the Space-grade DSA504RT
The DSA504RT delivers high-performance timing and integration at a cost-efficient price point National: Spacecraft timing systems must provide highly stable,...
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GigaDevice and Qt Group Announce Global Partnership
Singapore – GigaDevice, a leading semiconductor company specializing in Flash memory, 32-bit microcontrollers (MCUs), sensors, and analog products, has officially entered a strategic partnership...
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NeoCortec Congratulates Endrich Bauelemente on Winning Elektronik Magazine’s “Product of the Year 2026” Award
NeoCortec, manufacturer of the ultra-low-power bi-directional wireless mesh networking protocol stack NeoMesh, congratulates its distribution partner Endrich Bauelemente Vertriebs GmbH on...
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Cost-efficient Switch Regulator does not Compromise on Specifications
Gmunden – Wide input 0.5A switching regulators operate to 105°C in tiny SMD package. RECOM has launched its cost-efficient ROF-78K-0.5...
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RANsemi and TechPhosis Enable 5G OCUDU for Integrated Small Cells
Bristol, UK, and Gurugram, India – RANsemi Limited, the British semiconductor innovator pioneering Open RAN baseband System-on-Chip (SoC) platforms for 5G networks,...
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Advantest Partners with OpenLight to Develop Silicon Photonics Test Solutions for High-Volume Manufacturing
Today Advantest and OpenLight announce plans to partner and develop solutions for scalable, high-volume silicon photonics testing. As AI and high-performance computing workloads grow,...
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ST Unveils New Compact Direct Time-of-Flight 3D LiDAR Module
VL53L9 is the first direct Time-of-Flight (dToF) 3D LiDAR all-in-one module in ST’s portfolio, offering a resolution of 2.3K zones, wide...
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Infineon Collaborating with AWS to Accelerate MCU Evaluation to Shorten Development Cycles for Automotive Systems
Munich, Germany – Infineon Technologies AG is collaborating with Amazon Web Services (AWS) to accelerate microcontroller (MCU) evaluation to shorten...
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Nuvoton Strengthens Tethered XR Glass SoC Business Through Collaboration with Qualcomm Technologies
Hsinchu, Taiwan – Nuvoton Technology Corporation announced that it has agreed to collaborate with Qualcomm Technologies, Inc. on system-on-chip (SoC)...
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Electronics Era, India's no.1 growing B2B news forum on Electronics and Cutting Edge Technology is exploring the editorial opportunity for organizations working in the Electronics Manufacturing Services(EMS) Industry.
