Electronics Era

  • About Us
  • Advertise with Us
  • Contact Us
Header logo on website
Menu
  • News
    • Industry News
    • Product News
  • TECH ROOM
    • Semiconductor
    • AI/ML
    • Industry 4.0
    • IoT-Internet of Things
    • Robotic
    • Sensor
    • Security
    • VR / AR
    • Embedded
    • Power Electronics
    • Smart Machine
    • LED & Lighting
    • Medical Electronics
    • Telecom
    • Blockchain
    • Automation
    • 5G/6G
    • SMT/PCB/EMS
  • AUTOMOTIVE ELECTRONICS
    • EVs
    • HEVs
    • ADAS
    • Connected Cars
  • A & D
  • T & M
    • 5G testing
    • Oscilloscopes
    • SDN & NFV
    • RF & Wireless
  • RENEWABLES
    • Sustainability
  • DATA & CLOUD
    • Data Center
    • Cloud Computing
    • Big Data Analytics
  • Editor’s Pick
    • Tech Blog
    • Tech Article
    • White Papers
    • In Talks
    • Market Research
  • MORE
    • Webinars
    • Events
    • E-Mag
    • Subscription
    • Contact Us
  • News
    • Industry News
    • Product News
  • TECH ROOM
    • Semiconductor
    • AI/ML
    • Industry 4.0
    • IoT-Internet of Things
    • Robotic
    • Sensor
    • Security
    • VR / AR
    • Embedded
    • Power Electronics
    • Smart Machine
    • LED & Lighting
    • Medical Electronics
    • Telecom
    • Blockchain
    • Automation
    • 5G/6G
    • SMT/PCB/EMS
  • AUTOMOTIVE ELECTRONICS
    • EVs
    • HEVs
    • ADAS
    • Connected Cars
  • A & D
  • T & M
    • 5G testing
    • Oscilloscopes
    • SDN & NFV
    • RF & Wireless
  • RENEWABLES
    • Sustainability
  • DATA & CLOUD
    • Data Center
    • Cloud Computing
    • Big Data Analytics
  • Editor’s Pick
    • Tech Blog
    • Tech Article
    • White Papers
    • In Talks
    • Market Research
  • MORE
    • Webinars
    • Events
    • E-Mag
    • Subscription
    • Contact Us
Home News Industry News

Cost-Effective 3D SPI & AOI from ASC International at APEX 2023

Editorial by Editorial
December 16, 2022
in Industry News
Reading Time: 2 mins read
ASC Merlin AOI
Share on FacebookShare on Twitter

ASC International will exhibit in Booth #827 at the 2023 IPC APEX EXPO, scheduled to take place Jan. 24-26, 2023 at the San Diego Convention Center in California. ASC International will offer live demonstrations of its industry-leading SPI and AOI solutions. 

On display will be the VisionPro M500 offering an affordable option for true 3D bench top SPI. The VisionPro Merlin sets the standard as the price to performance leader for offline 2D-3D AOI and the VisionPro DMI combines both 3D SPI and 2D-3D AOI into a single platform for the most cost-effective inspection station island solution in the market today.

Also on display, the LineMaster Fusion 3D provides sophisticated 3D solder paste measurement coupled with an intuitive user interface and Windows® 10 OS. With only a few minutes of training, an operator can perform accurate and reliable 3D measurements of solder paste deposits as well as many other important SMT measurement applications. LineMaster’s completely automatic solder paste measurement process eliminates manual board handling as found with offline SPI systems and provides operators with immediate feedback to reduce printer related defects.

For more information about ASC International’s LineMaster Fusion 3D and other AOI/SPI products, visit https://www.ascinternational.com/products/solder-paste-inspection/linemaster-fusion-3d/.

Tags: 3DAOIASC Internationalautomated optical inspectionIPC APEX EXPOsolder paste inspectionSPI
Editorial

Editorial

Join Our Newsletter

* indicates required
Tweets by Era Electronics
Electronics Era

Electronics Era, India's no.1 growing B2B news forum on Electronics and Cutting Edge Technology is exploring the editorial opportunity for organizations working in the Electronics Manufacturing Services(EMS) Industry.

Follow Us

Browse by Category

  • 5G testing
  • 5G/6G
  • A & D
  • ADAS
  • AI/ML
  • Automation
  • AUTOMOTIVE ELECTRONICS
  • Big Data Analytics
  • Blockchain
  • Cloud Computing
  • Connected Cars
  • DATA & CLOUD
  • Data Center
  • Embedded
  • EVs
  • HEVs
  • In Talks
  • Industry 4.0
  • Industry News
  • IoT-Internet of Things
  • LED & Lighting
  • Market Research
  • Medical Electronics
  • News
  • Oscilloscopes
  • Power Electronics
  • Product News
  • RENEWABLES
  • RF & Wireless
  • Robotic
  • SDN & NFV
  • Security
  • Semiconductor
  • Sensor
  • Smart Machine
  • SMT/PCB/EMS
  • Sustainability
  • T & M
  • Tech Article
  • Tech Blog
  • TECH ROOM
  • Telecom
  • Uncategorized
  • VR / AR
  • White Papers

Recent News

comint scene

R&S Introduced Next Generation EW Solutions at SOFINS

March 30, 2023
ROHM

ROHM Chosen by Apex Microtechnology for Newest Line of Power Module

March 30, 2023
  • About Us
  • Advertise with Us
  • Contact Us

© 2022-23 TechZone Print Media | All Rights Reserved

No Result
View All Result
  • News
    • Industry News
    • Product News
  • TECH ROOM
    • Semiconductor
    • AI/ML
    • Industry 4.0
    • IoT-Internet of Things
    • Robotic
    • Sensor
    • Security
    • VR / AR
    • Embedded
    • Power Electronics
    • Smart Machine
    • LED & Lighting
    • Medical Electronics
    • Telecom
    • Blockchain
    • Automation
    • 5G/6G
    • SMT/PCB/EMS
  • AUTOMOTIVE ELECTRONICS
    • EVs
    • HEVs
    • ADAS
    • Connected Cars
  • A & D
  • T & M
    • 5G testing
    • Oscilloscopes
    • SDN & NFV
    • RF & Wireless
  • RENEWABLES
    • Sustainability
  • DATA & CLOUD
    • Data Center
    • Cloud Computing
    • Big Data Analytics
  • Editor’s Pick
    • Tech Blog
    • Tech Article
    • White Papers
    • In Talks
    • Market Research
  • MORE
    • Webinars
    • Events
    • E-Mag
    • Subscription
    • Contact Us

© 2022-23 TechZone Print Media | All Rights Reserved