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Home Editor's Desk Market Research

Electronic Adhesives Meet Thermoforming for In-Mold Electronics

Nimish by Nimish
January 16, 2026
in Market Research
Reading Time: 4 mins read
IDTechEx

In-Mold Electronics

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In-mold electronics (IME) is a manufacturing technology that prioritizes functionality and the seamless integration of electrical components into 3D structures, for a sophisticated and lightweight aesthetic. IDTechEx brings extensive knowledge of the market in their latest research report, “In-Mold Electronics 2025-2035: Forecasts, Technologies, Markets“.

A first glance at in-mold electronics

Printed circuit boards (PCB), despite being long incumbent within multiple electronic applications, have a rigidness that creates a difficulty in bringing electrical functions to 3D structures. Using IME could see a reduction in material consumption, cost, and waste, as well as bringing a new simplification to manufacturing processes.

The IME process is broken down by five simple steps, beginning with conductive traces printed onto a flat substrate, followed by the application of electrically conductive adhesives and the mounting of SMD components. Thermoforming then takes place with the application of heat and pressure, before the last stage of injection moulding.

Due to the nature of the IME manufacturing process, there are challenges involved in ensuring that the electronic components do not become compromised in the final stages of completion. IDTechEx’s research also highlights the importance of obtaining a high manufacturing yield, considering the interconnectivity of the parts, and the embedded nature of the circuitry.

IME forecasts spanning the next decade and beyond

IDTechEx provides a value capture chart for IME components: functional inks, including conductive inks and adhesives, are expected to be the greatest cost, holding a proportion of 21% of the cost of IME parts in 2035, largely as a result of the silver needed for silver conductive inks and the varying price of the metal. IDTechEx’s report, “Conductive Inks Market 2024-2034: Technologies, Applications, Players”, includes the latest research into conductive ink technology, and explores the scope for its integration across a number of technology sectors.

IDTechEx forecasts IME to make the most significant waves within the automotive industry in the lead up to 2035 in terms of revenue, with a large initial step up predicted towards the end of this decade. By 2035, 71.4% of revenue is expected to be generated from the automotive sector alone. Control applications for industry and home is predicted to be the second largest generator of IME revenue within the same period, followed closely by white goods, with medical and wearable applications not too far behind. The future of IME could see aerospace utilizing the lightweighting benefits to the technology, with developments being a few years behind automotives, though on a much smaller scale.

Laser induced forward transfer (LIFT) is a developing technology discussed in IDTechEx’s report that could one day potentially replace the stage of conductive ink screen-printing in the IME manufacturing process. Rather than having to switch the screen-printing mask for individual patterns, LIFT could be used for customized conductive and dielectric inks traces. Other emerging technologies and trends are also discussed within the report, with details on their potential advantages to the IME manufacturing processes.

IDTechEx’s report covers the commercial market for IME, alongside the latest R&D, key players, and the scope for broadening the horizons of adoption. For more information, visit the report, “In-Mold Electronics 2025-2035: Forecasts, Technologies, Markets” and IDTechEx’s wider report portfolios for Printed & Flexible Electronics Research Reports and Subscriptions.

Tags: IDTechExIn-Mold Electronics
Nimish

Nimish


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