Electronics Era

  • About Us
  • Advertise with Us
  • Contact Us
  • e-Mag
  • Webinars
Header logo on website
Advertisement
Advertisement
Menu
  • Home
  • News
    • Industry News
    • Product News
  • TECH ROOM
    • Sensor
    • VR / AR
    • Embedded
    • Medical Electronics
    • Industry 4.0
    • Robotic
    • Automation
    • Smart Machine
    • Component
    • MCU
    • Manufacturing
    • Aerospace & Defence
    • Security
    • Policy
    • RENEWABLES
      • Sustainability
  • Semiconductor
    • AUTOMOTIVE ELECTRONICS
      • EVs
      • HEVs
      • ADAS
      • Connected Cars
    • IoT-Internet of Things
      • Development Kit
      • IoT Design
    • Power Electronics
      • AC-DC/DC-DC Converters
      • Mosfets
      • IGBTs
      • LEDs
  • T & M
    • 5G testing
    • Oscilloscopes
    • SDN & NFV
    • RF & Wireless
  • AI/ML
  • Telecom
    • 5G/6G
  • Future Tech
    • Data Center
    • Cloud Computing
    • Big Data Analytics
  • Webinars
  • Editor’s Pick
    • Tech Article
    • Tech Blog
    • White Papers
    • EE-Tech Talk
    • Market Research
    • Videos
  • EE Awards
    • EE Awards 2025
    • EE Awards 2024
  • MORE
    • E-Mag
    • Events
    • MAGAZINE Subscription
    • Contact Us
Home News Industry News

Everspin Technologies Expands On-Shore MRAM Manufacturing Capacity

Agreement with Microchip Technology supports scalable manufacturing and on-shore long-term supply chain resilience

Vishaka Vardhan by Vishaka Vardhan
April 10, 2026
in Industry News
Reading Time: 2 mins read
everspin
Share on FacebookShare on TwitterShare on LinkedIn

Chandle — Everspin Technologies Inc. has announced its strategic manufacturing agreement with Microchip Technology to expand production capacity and strengthen long-term supply.

Everspin has entered into an initial 10-year agreement, that can be extended in 2-year increments, with Microchip Technology to augment its onshore manufacturing capacity for MRAM and Tunnel Magnetoresistive (TMR) sensor products.  The company will establish a copy exact (plus) MRAM line to manufacture MRAM and TMR sensor products currently produced at its line in Chandler, AZ.

“Everspin is expanding its manufacturing footprint to support the next phase of MRAM adoption, as customers look for both long-term supply stability and higher-density, more capable solutions,” says Sanjeev Aggarwal, President and CEO. “Our partnership with Microchip adds the production scale to support demand while continuing to advance our MRAM roadmap.”

Under the agreement, Everspin will stand up its industry leading magnetic technology and manufacturing process at a Microchip fabrication facility in Oregon.  Everspin will retain ownership of the intellectual property and manufacturing process while utilizing Microchip’s foundry services capacity. This expanded capacity will leverage Everspin’s strong balance sheet and partnerships.

“Microchip is pleased to collaborate with Everspin and provide foundry services from its large and expandable manufacturing capacity in our Oregon Fab,” said Michael Finley, Senior Vice President of Microchip’s Fab Operations. 

The agreement will provide Everspin and its customers with several strategic benefits:

  • Increased wafer capacity to support growth plans
  • On-shore second source for MRAM and TMR sensor products
  • Continuity of supply lasting well into the next decade
  • Additional opportunities for Everspin to continue R&D programs advancing MRAM capabilities for next generation use cases and workloads
  • International Traffic in Arms Regulations (ITAR) wafer processing capabilities

Everspin will continue to manufacture MRAM and TMR sensor wafers in its Chandler, AZ facility co-located at NXP.  The company plans to leverage its twenty years of MRAM production experience from Everspin’s Chandler operation as a benchmark for process bring up at Microchip ensuring a timely and seamless process installation.  Everspin expects the first products to ship from the Everspin-Microchip collaboration in the second half of 2027.

Tags: Everspin TechnologiesMicrochip Technology
Vishaka Vardhan

Vishaka Vardhan


Join Our Newsletter

* indicates required
Electronics Era

Electronics Era, India's no.1 growing B2B news forum on Electronics and Cutting Edge Technology is exploring the editorial opportunity for organizations working in the Electronics Manufacturing Services(EMS) Industry.

Follow Us

Browse by Category

  • 5G testing
  • 5G/6G
  • AC-DC/DC-DC Converters
  • ADAS
  • Aerospace & Defence
  • AI/ML
  • Automation
  • AUTOMOTIVE ELECTRONICS
  • Big Data Analytics
  • Blockchain
  • Cloud Computing
  • Component
  • Connected Cars
  • Data Center
  • Editor's Desk
  • EE-Tech Talk
  • Electronics Components
  • Embedded
  • EVs
  • Future Tech
  • HEVs
  • Industry 4.0
  • Industry News
  • IoT Design
  • IoT-Internet of Things
  • LED & Lighting
  • LEDs
  • Manufacturing
  • Market Research
  • MCU
  • Medical Electronics
  • Mosfets
  • News
  • Oscilloscopes
  • Policy
  • Power Electronics
  • Product News
  • RENEWABLES
  • RF & Wireless
  • Robotic
  • SDN & NFV
  • Security
  • Semiconductor
  • Sensor
  • Smart Machine
  • SMT/PCB/EMS
  • Sustainability
  • T & M
  • Tech Article
  • Tech Blog
  • TECH ROOM
  • Telecom
  • Uncategorized
  • VR / AR
  • White Papers

Recent News

Pickering

Pickering Expands Analog Output Portfolio for Functional Test and HIL

June 23, 2026
Infineon

Innoscience’s Current Products are not Affected by both Rulings of the Munich Regional Court

June 23, 2026
  • About Us
  • Advertise with Us
  • Contact Us

© 2022-23 TechZone Print Media | All Rights Reserved

No Result
View All Result
  • Home
  • News
    • Industry News
    • Product News
  • TECH ROOM
    • Sensor
    • VR / AR
    • Embedded
    • Medical Electronics
    • Industry 4.0
    • Robotic
    • Automation
    • Smart Machine
    • Component
    • MCU
    • Manufacturing
    • Aerospace & Defence
    • Security
    • Policy
    • RENEWABLES
      • Sustainability
  • Semiconductor
    • AUTOMOTIVE ELECTRONICS
      • EVs
      • HEVs
      • ADAS
      • Connected Cars
    • IoT-Internet of Things
      • Development Kit
      • IoT Design
    • Power Electronics
      • AC-DC/DC-DC Converters
      • Mosfets
      • IGBTs
      • LEDs
  • T & M
    • 5G testing
    • Oscilloscopes
    • SDN & NFV
    • RF & Wireless
  • AI/ML
  • Telecom
    • 5G/6G
  • Future Tech
    • Data Center
    • Cloud Computing
    • Big Data Analytics
  • Webinars
  • Editor’s Pick
    • Tech Article
    • Tech Blog
    • White Papers
    • EE-Tech Talk
    • Market Research
    • Videos
  • EE Awards
    • EE Awards 2025
    • EE Awards 2024
  • MORE
    • E-Mag
    • Events
    • MAGAZINE Subscription
    • Contact Us

© 2022-23 TechZone Print Media | All Rights Reserved

Advertisement
Advertisement