The global premier event for embedded systems — Embedded World 2026 — will take place in Nuremberg, Germany, from March 10 to 12. As a Gold Partner of NXP® Semiconductors, Forlinx will be present at Booth H3-561 to showcase breakthroughs and real-world applications of AI in industrial security and beyond.
During the event, Forlinx will showcase a diverse range of embedded products including System on Modules (SoMs), development boards, and embedded PCs based on NXP’s applications processors, including the i.MX 9, i.MX 8, and i.MX6 processors, Layerscape® processors, and i.MX RT crossover MCU series. Dynamic demos will cover multiple scenarios such as edge AI, smart industry, and smart cities.
A highlight will be the debut of a Multi‑Modal Demo for Industrial Security based on the NXP i.MX 95 applications processor and Ara240 Computing Card, co‑developed by Forlinx and NXP. The solution establishes an efficient dual‑hardware inference pipeline by integrating the 8 eTOPS eIQ® Neutron NPU in NXP’s i.MX 95 applications processor with the up to 40 eTOPS Ara240 Discrete NPU (DNPU) accelerator, thereby closing the perception‑inference‑action loop and advancing industrial security.
The demo illustrates three core advantages:
- Hybrid NPU Acceleration for Efficient Dynamic Task Allocation: Achieving efficient task division and collaboration between the i.MX 95 applications processor and Ara240 DNPU for real‑time video analysis and multi‑modal query tasks.
- Edge‑End Collaboration with High Efficiency & Reliability: Leverages an integrated edge‑to‑end inference architecture to ensure on‑device recognition and search tasks are performed with both low latency and high reliability.
- Multi‑Modal Generalization: Empowering industrial scenarios to achieve zero-shot recognition and understanding vision and language.
Since first collaborating in 2014, Forlinx and NXP have developed over 20 embedded solutions utilizing NXP chips, driving intelligent transformation across various industries globally. Moving forward, Forlinx is committed to strengthening the collaborative partnership with NXP, dedicated to providing global customers with superior and highly reliable embedded products and services, and working together to foster a thriving and dynamic industry ecosystem.
We warmly invite industry peers, partners, and media friends to join us at the Forlinx booth (H3-561) during Embedded World 2026 for face‑to‑face communication. Let’s explore the future of embedded intelligence and AI integration—see you in Nuremberg!
