Tokyo, Japan – Test Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, is pleased to announce its participation at NEPCON Japan 2026, to be held at Tokyo Big Sight from January 21 to 23, 2026. Visit Booth No. E15-40 to experience TRI’s latest test and inspection innovations for the SMT and Advanced Packaging / Semiconductor Manufacturing industries.
TRI will showcase its back-end inspection solutions, TR7007Q SII-S and TR7700Q SII-S. The TR7007Q SII-S delivers exceptional precision for Mini-LED, C4 bumps (~100 μm Ø), and 008004 paste inspection applications. The AI-powered 3D SEMI AOI TR7700Q SII-S offers advanced inspection capabilities for die, wire diameters as fine as 15 μm (0.6 mil), SiP, underfill, bumps, and more. TRI SEMI Applications include Inspection and Metrology Solutions for the Front-End to Back-End processes.
TRI’s lineup will feature the new 3D AXI TR7600FB SII, which incorporates an innovative X-ray imaging structure to address diverse product layouts and is optimized for specialized substrates, BGAs, multilayered structures, and SiP. The TR7600FB SII is the ideal choice for inspecting critical components that need to be imaged with high resolution, as the system allows the tube to get exceptionally close to the board without structural interference. Also presenting at NEPCON Japan will be the modular multi-core board tester TR5001 SII Inline.
Visit Booth No. E15-40 at NEPCON Japan 2026 to learn how TRI’s solutions can help you achieve higher production efficiency and reliability.
