Munich, Germany – Infineon Technologies AG has announced the release of ModusToolbox™ 3.0 – an improved development platform with enhanced support for multi-core project workflow. The release features dual-core device support, a new graphical tool for customer board support package (BSP) development, infrastructure support for ModusToolbox Packs and backend system improvements.
Infineon’s ModusToolbox 3.0 reduces overall development challenges for designers by enabling project creation and management for dual-core applications, with specific support for simultaneous debugging of both cores. This was previously not available in the Eclipse IDE for ModusToolbox development platform, and unlocks the potential available on dual-core devices such as Infineon’s PSoC™ 6. The new feature also establishes a development framework for future Infineon multi-core devices.
“Historically, the industry has not focused on providing a seamless development process once a designer moves beyond the vendor-provided development kit,” said Clark Jarvis, Software and Tools Product Marketer at Infineon. “Understanding this key challenge, this major new release of ModusToolBox provides a rich and seamless out-of-the-box development kit experience for customers with features to provide continuous product development on their own hardware. At the same time this enables customers to reuse their boards in a team development setting. We look forward to providing new features to meet our customers’ demands.”
ModusToolbox 3.0 delivers a unique developer experience, and aims to provide support for a variety of use cases including consumer IoT, industrial, smart home, wearable and many other applications. Features in ModusToolbox 3.0 are compatible for embedded application development with Infineon’s product solutions including PSoC 4, PSoC 6, XMC™, AIROC™ Wi-Fi, AIROC Bluetooth®, and EZ-PD™ PMG1 microcontrollers.
For more information, visit: www.infineon.io.