Munich, Germany – The demand for higher power levels in AI servers continues to grow, creating new challenges for manufacturers. To address this need, Infineon Technologies AG is expanding its XDP™ digital power controller IC family with a new device, the XDPP1188-200C. The controller is designed to meet the requirements of modern AI server power architectures. It supports intermediate bus conversions from 48 V to 12 V or lower, as well as future higher voltage DC systems, including the conversion of ±400 V or 800 VDC bus voltage to 48 V, 24 V, or 12 V. This approach helps minimize power losses on the busbars and power distribution paths.
The XDPP1188-200C complements Infineon’s CoolGaN-based HV IBC reference designs and offers customers who want to develop their own controller-based solutions maximum flexibility for 800-VDC or 48-V architectures. While the reference designs enable fast entry with validated solutions, the XDPP1188-200C allows optimization for customer-specific requirements. In 48-V systems, the controller works seamlessly with MV IBC modules to realize an optimized power supply chain from the intermediate bus to processor voltage regulation.
The XDPP1188-200C features an advanced feed-forward control mechanism that significantly improves response time and stability under dynamic input transient conditions. To handle the rapid power demand fluctuations typical of AI servers, the controller provides a non-linear fast transient response, maintaining accurate and stable voltage regulation during sudden load changes. The additional ADC inputs enable interleaved topologies to support higher power demands. In addition, the device integrates advanced power management techniques at light-load conditions, optimizing energy efficiency through phase shedding and burst operation. This enables high efficiency across a wide load range and reduces operating costs in data centers.
Furthermore, the XDPP1188-200C supports bidirectional configuration, enabling flexible power management and allowing energy to be directed efficiently where it is most needed within the system.
The XDP digital power controller IC family is optimized for use with Infineon’s broad AI server power delivery portfolio from grid to core – spanning solid-state transformers and circuit breakers, high-voltage and intermediate bus conversion, as well as second-stage DC conversion power modules. Leveraging the benefits of silicon (Si), silicon carbide (SiC), and gallium nitride (GaN) to achieve the highest efficiency, density, and robustness, Infineon gives customers a clear path to end-to-end power architectures with proven high-quality components, consistent design support, and scalable performance for next-generation AI server platforms.
Availability
The XDPP1188-200C digital power controller is available now as samples and will enter volume production in the first quarter of 2026. More information is available here.
APEC 2026
Don’t miss Infineon at APEC 2026, located at the Henry B. Gonzalez Convention Center in San Antonio, Texas, from March 22-26, 2026. Visit Infineon’s booth #1619 to see one of the industry’s broadest power device portfolios covering all relevant power technologies in silicon (Si), silicon carbide (SiC), and gallium nitride (GaN). To book a media interview, please contact media.relations@infineon.com.
