Electronics Era

  • About Us
  • Advertise with Us
  • Contact Us
  • e-Mag
  • Webinars
Header logo on website
Advertisement
Advertisement
Menu
  • Home
  • News
    • Industry News
    • Product News
  • TECH ROOM
    • Sensor
    • VR / AR
    • Embedded
    • Medical Electronics
    • Industry 4.0
    • Robotic
    • Automation
    • Smart Machine
    • Component
    • MCU
    • Manufacturing
    • Aerospace & Defence
    • Security
    • Policy
    • RENEWABLES
      • Sustainability
  • Semiconductor
    • AUTOMOTIVE ELECTRONICS
      • EVs
      • HEVs
      • ADAS
      • Connected Cars
    • IoT-Internet of Things
      • Development Kit
      • IoT Design
    • Power Electronics
      • AC-DC/DC-DC Converters
      • Mosfets
      • IGBTs
      • LEDs
  • T & M
    • 5G testing
    • Oscilloscopes
    • SDN & NFV
    • RF & Wireless
  • AI/ML
  • Telecom
    • 5G/6G
  • Future Tech
    • Data Center
    • Cloud Computing
    • Big Data Analytics
  • Webinars
  • Editor’s Pick
    • Tech Article
    • Tech Blog
    • White Papers
    • EE-Tech Talk
    • Market Research
    • Videos
  • EE Awards
    • EE Awards 2025
    • EE Awards 2024
  • MORE
    • E-Mag
    • Events
    • MAGAZINE Subscription
    • Contact Us
Home Semiconductor AUTOMOTIVE ELECTRONICS

Infineon Provides MEMS Technology for Valeo’s Ground Projection Module Based on Laser Beam Scanning

Vishaka Vardhan by Vishaka Vardhan
April 27, 2026
in AUTOMOTIVE ELECTRONICS
Reading Time: 3 mins read
Valeo Lighting
Share on FacebookShare on TwitterShare on LinkedIn

Munich, Germany — Infineon Technologies AG, a global leader in semiconductor and sensor solutions, and Valeo, a global leader in automotive lighting, are collaborating on a short distance ground projection module integrating Laser Beam Scanning (LBS). Their first collaborative innovation is showcased at 2026 AutoChina in Beijing, China, at the Valeo booth (Hall B2 Booth B2D01).

Achieving daytime visibility for ground projections necessitates high-performance systems. By incorporating Infineon’s 2D Micro Electronic Mechanical Systems (MEMS) mirror and its controller into Valeo’s high-definition ground projection module, the new solution achieves superior brightness, contrast, and resolution. While the first-generation delivers impactful bi-color output, the product roadmap is already planned for future iterations to include full-color capabilities. 

“At Infineon, we believe sensors are at the heart of every meaningful electronic application. With more than 30 years of expertise and our broad XENSIV™ portfolio, we are uniquely positioned to enable the next generation of automotive experiences,” says Thomas Schafbauer, Executive Vice President Sensor Units & RF at Infineon. “Our collaboration with Valeo demonstrates how we go beyond a single device to deliver comprehensive, automotive-qualified solutions. By combining Infineon’s 2D MEMS technology with Valeo’s advanced ground projection module, we are proud to be shaping the future of mobility together.”

Maurizio Martinelli, CEO of Valeo LIGHT Division said “At Valeo, we are thrilled to announce our new collaboration with Infineon Technologies. Thanks to our joint development, our new ground projection module meets the demands of customers, in China and in Europe, for a more personalized experience, as well as  the automotive industry’s stringent standards for quality, reliability, and performance. This initiative reflects our commitment to accelerating the adoption of advanced technologies and delivering innovative, integrated solutions that drive the future of mobility.”

A growing demand for experience and communication

As vehicles evolve to offer deeply personal experiences and more security, advanced communication and entertainment features are expected both outside and inside the vehicle. For example, the car can communicate as the user approaches it, utilizing features integrated into the car body or via projections onto the ground. The ground projection module offers a new layer of personalization, allowing OEMs to deliver unique and branded welcome and goodbye light signatures, or display tailored messages and graphics directly next to the vehicle. This capability transforms the simple act of approaching or leaving a car into a distinctive and memorable brand experience, enriching the emotional connection between the user and their vehicle.

Advancing road safety through V2X functionalities

Vehicle-to-Everything (V2X) communication, when integrated with advanced exterior lighting systems, is poised to significantly enhance road safety. By projecting dynamic, context-aware information onto the ground, vehicles can communicate critical data, such as immediate braking warnings, pedestrian crossings, or lane-change intentions, not just to other vehicles, but directly to nearby pedestrians, cyclists, and drivers of non-connected cars.

Subject to regulatory approval, this non-verbal, visually impactful communication system bridges the gap between digital V2X data and the physical environment, creating an intuitive layer of safety that complements existing warning systems and helps reduce cognitive load for all road users.

Availability

More information on Infineon XENSIV™ portfolio.

Tags: Automotive LightingLBSMEMS technologysensorValeo
Vishaka Vardhan

Vishaka Vardhan


Join Our Newsletter

* indicates required
Electronics Era

Electronics Era, India's no.1 growing B2B news forum on Electronics and Cutting Edge Technology is exploring the editorial opportunity for organizations working in the Electronics Manufacturing Services(EMS) Industry.

Follow Us

Browse by Category

  • 5G testing
  • 5G/6G
  • AC-DC/DC-DC Converters
  • ADAS
  • Aerospace & Defence
  • AI/ML
  • Automation
  • AUTOMOTIVE ELECTRONICS
  • Big Data Analytics
  • Blockchain
  • Cloud Computing
  • Component
  • Connected Cars
  • Data Center
  • Editor's Desk
  • EE-Tech Talk
  • Electronics Components
  • Embedded
  • EVs
  • Future Tech
  • HEVs
  • Industry 4.0
  • Industry News
  • IoT Design
  • IoT-Internet of Things
  • LED & Lighting
  • LEDs
  • Manufacturing
  • Market Research
  • MCU
  • Medical Electronics
  • Mosfets
  • News
  • Oscilloscopes
  • Policy
  • Power Electronics
  • Product News
  • RENEWABLES
  • RF & Wireless
  • Robotic
  • SDN & NFV
  • Security
  • Semiconductor
  • Sensor
  • Smart Machine
  • SMT/PCB/EMS
  • Sustainability
  • T & M
  • Tech Article
  • Tech Blog
  • TECH ROOM
  • Telecom
  • Uncategorized
  • VR / AR
  • White Papers

Recent News

Pickering

Pickering Expands Analog Output Portfolio for Functional Test and HIL

June 23, 2026
Infineon

Innoscience’s Current Products are not Affected by both Rulings of the Munich Regional Court

June 23, 2026
  • About Us
  • Advertise with Us
  • Contact Us

© 2022-23 TechZone Print Media | All Rights Reserved

No Result
View All Result
  • Home
  • News
    • Industry News
    • Product News
  • TECH ROOM
    • Sensor
    • VR / AR
    • Embedded
    • Medical Electronics
    • Industry 4.0
    • Robotic
    • Automation
    • Smart Machine
    • Component
    • MCU
    • Manufacturing
    • Aerospace & Defence
    • Security
    • Policy
    • RENEWABLES
      • Sustainability
  • Semiconductor
    • AUTOMOTIVE ELECTRONICS
      • EVs
      • HEVs
      • ADAS
      • Connected Cars
    • IoT-Internet of Things
      • Development Kit
      • IoT Design
    • Power Electronics
      • AC-DC/DC-DC Converters
      • Mosfets
      • IGBTs
      • LEDs
  • T & M
    • 5G testing
    • Oscilloscopes
    • SDN & NFV
    • RF & Wireless
  • AI/ML
  • Telecom
    • 5G/6G
  • Future Tech
    • Data Center
    • Cloud Computing
    • Big Data Analytics
  • Webinars
  • Editor’s Pick
    • Tech Article
    • Tech Blog
    • White Papers
    • EE-Tech Talk
    • Market Research
    • Videos
  • EE Awards
    • EE Awards 2025
    • EE Awards 2024
  • MORE
    • E-Mag
    • Events
    • MAGAZINE Subscription
    • Contact Us

© 2022-23 TechZone Print Media | All Rights Reserved

Advertisement
Advertisement