Plymouth, WI — Kurtz Ersa Inc. is strengthening its position in microelectronics and semiconductor technology. Effective September 1, 2025, ATV Technologie GmbH officially became part of the Kurtz Ersa Group and will operate under the new name Kurtz Ersa Semicon GmbH.
This strategic integration unites Kurtz Ersa’s established reflow soldering expertise with ATV’s advanced vacuum and specialty thermal processing technologies, creating a complete solution portfolio for microelectronics, semiconductor packaging, and power electronics manufacturing.
Advanced Thermal Solutions for Semiconductor Applications
At the core of the expanded lineup is the SRO i-Line reflow platform, engineered for high-precision semiconductor and substrate processing. The system delivers exceptional temperature uniformity, tightly controlled heating zones, optimized cooling performance, and vacuum in combination with Formic Acid and Nitrogen, making it well suited for DCB/AMB substrate soldering, power module assembly, and other thermally demanding applications. Its stable heating technology ensures repeatable results across both development and production environments.
Complementing the SRO i-Line are the VADU vacuum reflow systems, including models such as the VADU 200XL and VADU 300XL. These batch vacuum platforms are specifically designed to reduce voiding in solder joints—an essential requirement for automotive, industrial, and wide bandgap semiconductor applications. Through controlled vacuum processing and precise thermal profiling, the VADU systems support die attach, substrate soldering, and advanced packaging processes where reliability is critical.
The portfolio also supports sintering, curing, and additional specialty thermal processes required for next-generation semiconductor devices. With programmable process control, data logging, and controlled atmosphere capabilities, the systems are built to meet strict quality, traceability, and performance standards.
A Dedicated Semiconductor Focus
The formation of Kurtz Ersa Semicon GmbH reflects the company’s long-term investment in microelectronics and semiconductor technology. By combining inline reflow platforms with batch vacuum systems, Kurtz Ersa now offers customers a coordinated path from R&D and pilot production to scalable manufacturing—while maintaining precise thermal control and documented process repeatability.
“Semiconductor manufacturers are facing tighter process windows and increasing reliability requirements,” said Ernie Grice, Vice President Sales at Kurtz Ersa, Inc. “With Kurtz Ersa Semicon GmbH, we are bringing together complementary technologies and focused expertise to deliver advanced thermal solutions tailored specifically for microelectronics and power electronics production.”
With decades of experience in thermal processing and a growing global presence, Kurtz Ersa continues to expand its capabilities to support the evolving needs of semiconductor manufacturers worldwide.
For more information about Kurtz Ersa and its semiconductor solutions, visit www.ersa.com.
