Leankon, a global provider of innovative antenna solutions, has announced the LK1810701, a miniature 2.4 GHz on-ground Surface Mount Device (SMD) antenna designed to operate directly over host PCB ground planes without requiring a traditional clearance keep-out zone. By leveraging advanced 3D Laser Direct Structuring (LDS) technology and high-permittivity materials, the LK1810701 addresses critical board space constraints in compact wireless devices, freeing up valuable PCB real estate without compromising RF performance or layout flexibility.
Overcoming PCB Keep-Out Constraints
In conventional RF layout design, standard off-the-shelf antennas—such as traditional monopole and loop configurations—require sizeable ground keep-out regions to establish resonance and maintain acceptable radiation efficiency. For space-constrained IoT nodes, wearables, and compact electronics, every millimeter of PCB area is critical, making ground clearance requirements a significant design bottleneck.
Designing an antenna capable of direct placement over metal surfaces has historically presented severe impedance matching and efficiency challenges. The LK1810701 overcomes these limitations through a 3D helix topology engineered specifically to resonate directly above the ground plane, enabling seamless integration into high-density circuit layouts.
3D LDS Architecture and Advanced Material Selection
To achieve its ultra-compact 3 mm x 3 mm x 4 mm footprint while preserving RF performance, Leankon utilizes Laser Direct Structuring (LDS) on a specialized plastic carrier. This process forms precise 3D conductive traces that realize a volumetric helix structure. To further shrink the physical dimensions without shifting the operational band, high-Dk (dielectric constant) carrier materials are deployed.
To combat the intrinsic dielectric losses common in ultra-small antenna designs, the carrier incorporates low-loss Liquid Crystal Polymer (LCP) material combined with an internal hollow structure. This dual approach significantly minimizes substrate dissipation, ensuring high efficiency despite the miniature form factor.
Key Performance Specifications
| Parameter | Specification / Value |
| Part Number | LK1810701 |
| Frequency Range | 2.400 – 2.485 GHz |
| VSWR | < 2.0 |
| Average Efficiency | > 60% |
| Peak Gain | 1.9 dBi |
| Radiation Pattern | Omni-directional |
| Dimensions | 3 mm x 3 mm x 4 mm |
| Carrier Material | Liquid Crystal Polymer (LCP) with internal hollow design |
| Manufacturing Technology | Laser Direct Structuring (LDS) 3D Helix |
| Mounting Type | SMD / SMT Reflow Compatible |
Standard SMT Assembly & Production Integration
The LK1810701 is packaged as a standard SMT component, fully compatible with automated pick-and-place processes and standard reflow soldering profiles. This eliminates manual assembly steps, reduces manufacturing costs, and ensures repeatable RF performance across high-volume production runs.
Evaluation samples and development boards for pre-verification are currently available directly from Leankon.
