Skip to main content

Electronics Era

  • About Us
  • Advertise with Us
  • Contact Us
  • e-Mag
  • Webinars
Header logo on website
Advertisement
Advertisement
Menu
  • Home
  • News
    • Industry News
    • Product News
  • TECH ROOM
    • Sensor
    • VR / AR
    • Embedded
    • Medical Electronics
    • Industry 4.0
    • Robotic
    • Automation
    • Smart Machine
    • Component
    • MCU
    • Manufacturing
    • Aerospace & Defence
    • Security
    • Policy
    • RENEWABLES
      • Sustainability
  • Semiconductor
    • AUTOMOTIVE ELECTRONICS
      • EVs
      • HEVs
      • ADAS
      • Connected Cars
    • IoT-Internet of Things
      • Development Kit
      • IoT Design
    • Power Electronics
      • AC-DC/DC-DC Converters
      • Mosfets
      • IGBTs
      • LEDs
  • T & M
    • 5G testing
    • Oscilloscopes
    • SDN & NFV
    • RF & Wireless
  • AI/ML
  • Telecom
    • 5G/6G
  • Future Tech
    • Data Center
    • Cloud Computing
    • Big Data Analytics
  • Webinars
  • Editor’s Pick
    • Tech Article
    • Tech Blog
    • White Papers
    • EE-Tech Talk
    • Market Research
    • Videos
  • EE Awards
    • EE Awards 2025
    • EE Awards 2024
  • MORE
    • E-Mag
    • Events
    • MAGAZINE Subscription
    • Contact Us
Home Uncategorized

Next-generation MIL-HD2 Connector Series from Amphenol Aligned with SOSA™/VITA 91 Now at Powell Electronics

Ideal for high-density, 56G PAM4 applications

Vishaka Vardhan by Vishaka Vardhan
April 14, 2026
in Uncategorized
Reading Time: 2 mins read
Powell
Share on FacebookShare on TwitterShare on LinkedIn

April 2026: Now available throughPowell Electronics, the supplier of connectors and more for high-rel applications including defence, aerospace and industrial, is the MIL-HD2 connector series from Amphenol, a next-generation, SOSA™-aligned solution engineered to meet the most demanding requirements of modern military embedded systems, e.g. embedded computing, radar, electronic warfare, and high-speed communications systems.

Designed in alignment with The Open Group Sensor Open Systems Architecture™ (SOSA) technical standard and supporting VITA 91 requirements, the MIL-HD2 series delivers industry-leading density and performance for 3U applications. Supporting data rates up to 56Gb/s PAM4, the connector family enables system architects to address increasing bandwidth demands while maintaining compatibility with commercial off-the-shelf (COTS) architectures and avoiding costly redesign cycles.

The MIL-HD2 series has been developed to support next-generation switch and payload card designs, where tighter card pitches and reduced chassis footprints are critical. Available in 3-, 4-, and 6-pair configurations, it provides the highest number of differential pairs currently available in a 3U form factor at 56Gb/s PAM4 speeds.

Engineered for high-speed signal integrity, the MIL-HD2 series incorporates proprietary crosstalk reduction technologies, improved impedance matching, and proven EMI performance. Its compact 1.80mm pitch enables exceptional density, supporting between 28 and 84 differential pairs per inch. The design also features a 15.7 mil drill-compliant pin that allows for deeper backdrilling, further enhancing high-speed performance in advanced system designs.

Mechanical and reliability enhancements include shielded contacts that mate ahead of signal contacts, delivering up to 4mm of wipe for improved connection integrity, as well as support for hot-plugging in mission-critical environments. Additional flexibility is provided through embedded capacitor options and optimized footprints, enabling designers to tailor solutions to specific application requirements.

For further information about Powell in Europe please visit: www.powell-europe.com

For project design or procurement support please contact: Europe@powell.com

Vishaka Vardhan

Vishaka Vardhan


Join Our Newsletter

* indicates required
Electronics Era

Electronics Era, India's no.1 growing B2B news forum on Electronics and Cutting Edge Technology is exploring the editorial opportunity for organizations working in the Electronics Manufacturing Services(EMS) Industry.

Follow Us

Browse by Category

  • 5G testing
  • 5G/6G
  • AC-DC/DC-DC Converters
  • ADAS
  • Aerospace & Defence
  • AI/ML
  • Automation
  • AUTOMOTIVE ELECTRONICS
  • Big Data Analytics
  • Blockchain
  • Cloud Computing
  • Component
  • Connected Cars
  • Data Center
  • Editor's Desk
  • EE-Tech Talk
  • Electronics Components
  • Embedded
  • EVs
  • Future Tech
  • HEVs
  • Industry 4.0
  • Industry News
  • IoT Design
  • IoT-Internet of Things
  • LED & Lighting
  • LEDs
  • Manufacturing
  • Market Research
  • MCU
  • Medical Electronics
  • Mosfets
  • News
  • Oscilloscopes
  • Policy
  • Power Electronics
  • Product News
  • RENEWABLES
  • RF & Wireless
  • Robotic
  • SDN & NFV
  • Security
  • Semiconductor
  • Sensor
  • Smart Machine
  • SMT/PCB/EMS
  • Sustainability
  • T & M
  • Tech Article
  • Tech Blog
  • TECH ROOM
  • Telecom
  • Uncategorized
  • VR / AR
  • White Papers

Recent News

HyperShock

Multicomp Pro Returns to the BattleBox with Team HyperShock

July 8, 2026
advantics

Infineon will Supply CoolSiC™ MOSFETs 1200 V and Matching Dual-Channel EiceDRIVER™ 2EDB9259Y Gate Drivers to ADVANTICS

July 8, 2026
  • About Us
  • Advertise with Us
  • Contact Us

© 2022-23 TechZone Print Media | All Rights Reserved

No Result
View All Result
  • Home
  • News
    • Industry News
    • Product News
  • TECH ROOM
    • Sensor
    • VR / AR
    • Embedded
    • Medical Electronics
    • Industry 4.0
    • Robotic
    • Automation
    • Smart Machine
    • Component
    • MCU
    • Manufacturing
    • Aerospace & Defence
    • Security
    • Policy
    • RENEWABLES
      • Sustainability
  • Semiconductor
    • AUTOMOTIVE ELECTRONICS
      • EVs
      • HEVs
      • ADAS
      • Connected Cars
    • IoT-Internet of Things
      • Development Kit
      • IoT Design
    • Power Electronics
      • AC-DC/DC-DC Converters
      • Mosfets
      • IGBTs
      • LEDs
  • T & M
    • 5G testing
    • Oscilloscopes
    • SDN & NFV
    • RF & Wireless
  • AI/ML
  • Telecom
    • 5G/6G
  • Future Tech
    • Data Center
    • Cloud Computing
    • Big Data Analytics
  • Webinars
  • Editor’s Pick
    • Tech Article
    • Tech Blog
    • White Papers
    • EE-Tech Talk
    • Market Research
    • Videos
  • EE Awards
    • EE Awards 2025
    • EE Awards 2024
  • MORE
    • E-Mag
    • Events
    • MAGAZINE Subscription
    • Contact Us

© 2022-23 TechZone Print Media | All Rights Reserved

Advertisement
Advertisement