Munich, May 2025 – Panasonic Industry has recently introduced the new B511-1C Evaluation Board (ENW89861AXKF). It features a PAN B511-1C (ENW89861A3KF) module which is based on the Nordic Semiconductor nRF54L15 single-chip controller.
The evaluation board features a pin header in Arduino UNO footprint configurable as shield or board and a mikroBUS socket for easy compatibility with external components like sensors and displays for quick prototyping. It comes with an additional 64Mbit memory on board and a board configuration which is available within Zephyr / nRF Connect SDK. Interested parties can access all the different module interfaces like GPIOs (all 32), NFC-A, current measurement pins, and Segger J-Link on-board debugger easily, which makes the evaluation board ideally suited for the evaluation of the PAN B511-1C module and rapid prototyping of lighting applications, home appliances, industrial sensors, medical devices, healthcare wearables, energy management devices and solar farms.
The newly launched small and cost-effective PAN B511-1C Bluetooth module from Panasonic Industry features great performance and great memory while minimizing current consumption based on the Nordic nRF54L15 single chip controller.
A dedicated number of GPIOs is positioned at the edge of the module, with the rest of the GPIOs located at the bottom pad, with the module providing access to all 32 GPIOs of the chip. With its unique hybrid packaging design of castellated holes and LGA, the module remains at the small size of a 2-cent coin. This way, it combines the advantages of both worlds without compromising on size and enables one of the best pin-to-size ratios for Bluetooth modules currently on the market.
The PAN B511-1C Bluetooth module will be certified for CE RED, FCC, ISED and MIC. Samples are already available now and the start of mass production is scheduled for June 2025.
For more information on the latest PAN B511-1C Bluetooth module please click HERE or check the PAN B511 – Wireless Connectivity Development Hub
