Electronics Era

  • About Us
  • Advertise with Us
  • Contact Us
  • e-Mag
  • Webinars
Header logo on website
Advertisement
Advertisement
Menu
  • Home
  • News
    • Industry News
    • Product News
  • TECH ROOM
    • Sensor
    • VR / AR
    • Embedded
    • Medical Electronics
    • Industry 4.0
    • Robotic
    • Automation
    • Smart Machine
    • Component
    • MCU
    • Manufacturing
    • Aerospace & Defence
    • Security
    • Policy
    • RENEWABLES
      • Sustainability
  • Semiconductor
    • AUTOMOTIVE ELECTRONICS
      • EVs
      • HEVs
      • ADAS
      • Connected Cars
    • IoT-Internet of Things
      • Development Kit
      • IoT Design
    • Power Electronics
      • AC-DC/DC-DC Converters
      • Mosfets
      • IGBTs
      • LEDs
  • T & M
    • 5G testing
    • Oscilloscopes
    • SDN & NFV
    • RF & Wireless
  • AI/ML
  • Telecom
    • 5G/6G
  • Future Tech
    • Data Center
    • Cloud Computing
    • Big Data Analytics
  • Webinars
  • Editor’s Pick
    • Tech Article
    • Tech Blog
    • White Papers
    • EE-Tech Talk
    • Market Research
    • Videos
  • EE Awards
    • EE Awards 2025
    • EE Awards 2024
  • MORE
    • E-Mag
    • Events
    • MAGAZINE Subscription
    • Contact Us
Home Semiconductor

POLYN Technology Announces First Silicon-Implemented NASP™ Chip 

New Analog Neuromorphic Processors Offer Microwatt Edge AI

Nimish by Nimish
October 28, 2025
in Semiconductor
Reading Time: 3 mins read
POLYN Technology

POLYN Silicon-Implemented NASP™ Chip

Share on FacebookShare on TwitterShare on LinkedIn

Booth HB143, CES Unveiled Europe, Amsterdam – POLYN Technology, a pioneer in ultra-low-power neuromorphic computing, today announced the successful manufacturing and testing of the world’s first silicon-proven implementation of its unique NASP™ (Neuromorphic Analog Signal Processing) technology.

The NASP platform employs trained neural networks in the analog domain to perform AI inference with much lower power consumption than conventional digital neural processors.

POLYN will demonstrate its first NASP chips available for ordering at CES 2026 in Las Vegas, Nevada, January 6-9, in Hall G, Booth #61701, and also showcases a limited selection at CES Unveiled Europe in Amsterdam. 

NASP chips with AI cores process sensor signals in their native analog form in microseconds, using microwatt-level power and eliminating all overhead associated with digital operations. This is ideal for always-on edge devices. Application-specific NASP chips can be designed for a diverse range of edge AI applications, including audio, vibration, wearable, robotics, industrial, and automotive sensing.

This key milestone validates both NASP technology and POLYN’s revolutionary design tools, which automatically convert trained digital neural network models into ultra-low-power analog neuromorphic cores ready for manufacturing in standard CMOS processes. The testing confirmed the chip’s parameters strictly match its model.

“This is not just another chip — it’s proof that our novel technology works in silicon,” said Aleksandr Timofeev, CEO and Founder of POLYN Technology. “For the first time, we generated an asynchronous, fully analog neural-network core implementation in silicon directly from a digital model. It opens the door to an entirely new design paradigm — neural computation in the analog domain, with digital-class accuracy and microwatt-level energy use.”

This first chip contains a VAD core for real-time voice activity detection. It marks the first step toward a new level of voice processing offered by POLYN. It will be followed by other cores POLYN is developing for speaker recognition and voice extraction, enhancing home appliances, critical communications headsets, and other voice-controlled devices.

Customers developing products with ultra-low power voice control can apply online for the NASP VAD chip evaluation kit.

The first NASP VAD chip offers breakthrough performance:

  • Ultra-low power: approximately 34 µW during continuous operation
  • Ultra-low latency: 50 microseconds per inference
  • Fully asynchronous operation: no clock, no ADC/DAC conversion

POLYN’s NASP technology and design tools give semiconductor and AI developers a new way to quickly implement neural networks directly in analog silicon. It offers process-agnostic design across 40–90 nm CMOS nodes and automatic conversion from digital ML models.

“The successful introduction of our first NASP chip transforms NASP from a concept into a production-ready technology,” said Timofeev. “It proves that analog neuromorphic computation can coexist with today’s digital flows — opening vast opportunities for chipmakers, OEMs, and AI innovators.”

POLYN is preparing evaluation kits for early adopters and extending the implementation of its NASP product families for automotive, critical communication, and wearable applications.

Tags: NASP™ ChipPOLYN Technology
Nimish

Nimish

Join Our Newsletter

* indicates required
Electronics Era

Electronics Era, India's no.1 growing B2B news forum on Electronics and Cutting Edge Technology is exploring the editorial opportunity for organizations working in the Electronics Manufacturing Services(EMS) Industry.

Follow Us

Browse by Category

  • 5G testing
  • 5G/6G
  • AC-DC/DC-DC Converters
  • ADAS
  • Aerospace & Defence
  • AI/ML
  • Automation
  • AUTOMOTIVE ELECTRONICS
  • Big Data Analytics
  • Blockchain
  • Cloud Computing
  • Component
  • Connected Cars
  • Data Center
  • Editor's Desk
  • EE-Tech Talk
  • Electronics Components
  • Embedded
  • EVs
  • Future Tech
  • HEVs
  • Industry 4.0
  • Industry News
  • IoT Design
  • IoT-Internet of Things
  • LED & Lighting
  • LEDs
  • Manufacturing
  • Market Research
  • MCU
  • Medical Electronics
  • Mosfets
  • News
  • Oscilloscopes
  • Policy
  • Power Electronics
  • Product News
  • RENEWABLES
  • RF & Wireless
  • Robotic
  • SDN & NFV
  • Security
  • Semiconductor
  • Sensor
  • Smart Machine
  • SMT/PCB/EMS
  • Sustainability
  • T & M
  • Tech Article
  • Tech Blog
  • TECH ROOM
  • Telecom
  • Uncategorized
  • VR / AR
  • White Papers

Recent News

Nuvoton

Nuvoton’s NuMicro M2354 Successfully Implements Post-Quantum Cryptography

June 11, 2026
AAEON

AAEON Secures IEC 62443-4-1 Certification, Strengthening Commitment to Industrial Cybersecurity

June 11, 2026
  • About Us
  • Advertise with Us
  • Contact Us

© 2022-23 TechZone Print Media | All Rights Reserved

No Result
View All Result
  • Home
  • News
    • Industry News
    • Product News
  • TECH ROOM
    • Sensor
    • VR / AR
    • Embedded
    • Medical Electronics
    • Industry 4.0
    • Robotic
    • Automation
    • Smart Machine
    • Component
    • MCU
    • Manufacturing
    • Aerospace & Defence
    • Security
    • Policy
    • RENEWABLES
      • Sustainability
  • Semiconductor
    • AUTOMOTIVE ELECTRONICS
      • EVs
      • HEVs
      • ADAS
      • Connected Cars
    • IoT-Internet of Things
      • Development Kit
      • IoT Design
    • Power Electronics
      • AC-DC/DC-DC Converters
      • Mosfets
      • IGBTs
      • LEDs
  • T & M
    • 5G testing
    • Oscilloscopes
    • SDN & NFV
    • RF & Wireless
  • AI/ML
  • Telecom
    • 5G/6G
  • Future Tech
    • Data Center
    • Cloud Computing
    • Big Data Analytics
  • Webinars
  • Editor’s Pick
    • Tech Article
    • Tech Blog
    • White Papers
    • EE-Tech Talk
    • Market Research
    • Videos
  • EE Awards
    • EE Awards 2025
    • EE Awards 2024
  • MORE
    • E-Mag
    • Events
    • MAGAZINE Subscription
    • Contact Us

© 2022-23 TechZone Print Media | All Rights Reserved

Advertisement
Advertisement