Oxfordshire, UK – Direct Insight, the UK-based technical systems integrator focused on system-on-module solutions, can now deliver and support development for the new QS91, featuring NXP’s i.MX 91 applications processor, which delivers an optimized blend of security, features, and energy-efficient performance for the next generation of Linux-based IoT and industrial applications. The QS91 is a tiny solderable computer module, measuring just 27x27mm, with 2.6mm total height in a single-sided assembly. Its QFN-style lead style design has a 1mm pitch with 100 pads – and in addition to providing EMC-compliant signal routing, the ground pad on the bottom side is also used for heat transfer, ensuring highly efficient thermal characteristics.
“With the spiralling cost of RAM due to the AI boom driving up the cost of embedded modules,” notes David Pashley, co-founder & Managing Director at Direct Insight, “Some applications need more cost-effective and pragmatic solutions – and the QS91’s design offers energy efficiency and reduced cost, in comparison to the i.MX 93-based QS93. As the entry point into NXP’s i.MX 9 series, the single-core i.MX 91 applications processor delivers an optimised blend of security, features, and low-power performance to enable developers to quickly create new Linux-based IoT edge devices – but also provides the extensibility and ease of programming for applications to evolve over time.”
Manufactured by Direct Insight’s long-standing partner, Aachen-based Ka-Ro Electronics, the new QS91 SoM features NXP’s i.MX 91 applications processor, powered by a single-core 64-bit ARM Cortex-A55, running at 1.4 GHz. Display support is simplified by the RGB parallel display interface and a wide range of connectivity is supported, including dual USB, CAN-FD and Gigabit Ethernet. NXP’s Edgelock secure enclave provides a silicon root of trust and robust security architecture to help protect edge devices against physical and network attacks.
The QS91 adds 512MB LPDDR4 RAM and 4GB eMMC Flash memory, while its low cost QFN-style solder-down SoM format measures just 27mm square with a height of only 2.6mm and provides both excellent EMC and highly efficient thermal performance, meaning that usually no heatsink is required – ideal for space-constrained applications. An extended industrial operating temperature range of -25°C to +85°C is supported and the module requires a single 3.3V power supply. A dedicated development kit (QS91 QSBASE1 Evalkit) is available, equipped with a Linux BSP.
A SODIMM version of the module, the TX91, is also available immediately.
Learn more, download the datasheet, and order modules or development kits at: directinsight.co.uk/ka-ro-qs91-solder-down-module-with-low-power-imx91/
