Mumbai/Navi Mumbai, March 04, 2026: RRP Electronics Limited, the first company to establish an Outsourced Semiconductor Assembly and Test (OSAT) facility in Maharashtra, today announced the allocation of Industrial Plot No. A-1, measuring approximately 101 acres (about 410,000 square metres), located in Khalapur Phase-3 and Expansion Industrial Area. The land parcel has been earmarked for the development of a large-scale integrated semiconductor manufacturing and advanced packaging campus.
The proposed development is intended to accommodate multiple OSAT (Outsourced Semiconductor Assembly and Test) production lines, advanced wafer-level packaging (WLP) facilities, and potential semiconductor fabrication (fab) units, supported by requisite approvals. The site provides the scale necessary to support phased development aligned with RRP Electronics’ long-term manufacturing roadmap.
Rajendra Chodankar, Chairman, RRP Electronics Limited, said, “The allocation of this ~101-acre land parcel at Khalapur is a foundational step in RRP Electronics’ journey to build a large-scale, integrated semiconductor manufacturing campus in Maharashtra. Our intent is to develop this site in phases, bringing together packaging, advanced wafer-level, packaging, and potential fabrication capabilities over time, along with necessary approvals. This development aligns with the India Semiconductor Mission and the Atmanirbhar Bharat vision. It enables more of the semiconductor value chain to be anchored within the country, strengthening India’s position as a self-reliant and trusted manufacturing hub for global customers.”
The development vision for the Khalapur campus includes co-locating packaging, advanced wafer-level packaging, and potential fabrication capabilities within a single industrial site, enabling operational coordination and future capacity expansion. The planned campus is expected to support manufacturing and research activities serving sectors such as automotive, industrial electronics, telecommunications, and consumer applications, in line with India’s strategic push to deepen domestic semiconductor capabilities.
About RRP Electronics Limited:
RRP Electronics Limited is a pioneer in India’s semiconductor revolution and the first company to establish an Outsourced Semiconductor Assembly and Test (OSAT) facility in the state of Maharashtra. Headquartered in Navi Mumbai, the company is pursuing a phased investment roadmap comprising Phase I with an outlay of ₹12,035 crore and Phase II with an outlay of ₹24,000 crore, aimed at building capabilities across semiconductor packaging and wafer fabrication.
Backed by strategic investor and cricket legend Sachin Tendulkar, and under the leadership of technocrat-entrepreneur Rajendra Chodankar, RRP Electronics has forged high-impact technical collaborations with global leaders from Taiwan for Legacy packaging (QFN/BGA) and memory Module. In addition, the strong hand-holding approach extended by many global technology providers and fab set-ups significantly strengthens RRP’s position as a front-runner in the industry. The company has its facility in Mahape which is fully operational, serving sectors including automotive, industrial, and telecommunications, while its upcoming 100-acre project aims to make India a self-reliant hub for high-tech manufacturing under the ‘Make in India’ initiative.
