SAN JOSE, CA ― SHENMAO Technology is proud to commemorate its 50th anniversary. Founded in 1973, SHENMAO has witnessed the evolution of Taiwan’s electronics industry, playing a pivotal role in shaping the landscape of solder materials and setting new industry standards.
During the early days in Taiwan, the electronics industry predominantly relied on processing supplied materials. Raw materials, such as tin, were acquired and melted using molds at high temperatures, resulting in the production of primarily industrial solder bars. The shift towards soldering materials only transpired as electronic components progressively reduced in size.
In 2004, SHENMAO seized a remarkable opportunity for internationalization and growth. With the European Union’s mandate to transition to non-toxic, lead-free manufacturing processes for consumer electronics, driven by environmental concerns, SHENMAO took proactive measures. The company secured non-toxic, lead-free manufacturing technology from the Japanese company THERESA, paving the way for lead solder paste technology and earning HP certification under its own brand.
Following the success with HP, SHENMAO established collaborative partnerships with prominent electronics manufacturers such as Dell, Lenovo, Acer, and Asus. Gradually, SHENMAO captured approximately 18% of the global tin material market, ranking as the world’s third-largest solder materials supplier, trailing only behind Japanese and American manufacturers.
In 2016, Intel invited SHENMAO to develop low-temperature solder paste products, addressing the challenge of circuit board warpage when exposed to high temperatures. This marked a significant milestone in the company’s pursuit of sustainable growth.
To further support its commitment to innovation, SHENMAO inaugurated an advanced materials research and development center in 2016. This move allowed the company to expand its scope into diverse applications, including advanced semiconductor packaging, low-orbit satellites, and electric vehicles. Notably, SHENMAO entered the low-temperature tin product sector in collaboration with Intel, aligning with energy conservation and carbon reduction initiatives.
Looking ahead, the demand for low-temperature solder paste is expected to extend beyond processors to encompass memory on motherboards, NB displays, and power supplies, all driven by green manufacturing processes.
In addition to low-temperature solder paste, SHENMAO has ventured into producing recycled solder paste through a specialized recycling process. This sustainable approach is used in Apple iPhone chargers, aligning with the growing trend of energy conservation and carbon reduction.
SHENMAO’s efforts in the recycled solder paste sector have captured Apple’s attention. Both companies are now collaborating on mobile phone chargers, successfully completing the UAL product certification through Delta. Additionally, SHENMAO has forged a long-term partnership with Microsoft, with the aspiration of using recycled solder paste in the mainboards of the XBOX game console.
In a significant strategic move, SHENMAO followed in the footsteps of Wistron by acquiring a factory in Mexico. Construction is set to commence in October of this year, with plans to provide automotive solder paste to Tesla and make a strategic entry into the electric vehicle market.
SHENMAO is resolute in embracing the ESG (Environmental, Social, and Governance) trend, driving sustainable growth, and identifying new opportunities to shape the next 50 years.
For more information, please visit www.shenmao.com.