SAN JOSE, CA ― SHENMAO America, Inc. continues to innovate new solder pastes and is pleased to introduce its newest offering: PF735-EP307 Joint Enhanced Solder Paste (JEP). The new low melting point epoxy-based solder material has been developed for extremely fine-pitch or fine pad soldering, especially advanced display assembly.
JEP has the advantages of conventional solder paste and anisotropic conductive paste, i.e., self-alignment and planar insulation, respectively. The epoxy is cured after reflow and provides excellent bonding strength and joint protection. Reliability performance is enhanced as well. PF735-EP307 solder paste adopts the newly designed epoxy-based flux that performs better in regards to printability, longer printing lifetime and better reliability than typical epoxy-based solder pastes.
With the low melting point alloy PF735, the new solder paste can reduce the reflow temperature to below 190°C compared to lead-free soldering, typically 240°-250°C, and hence decrease PCB and substrate deformation while saving energy, reducing the thermal stability requirement of PCBs and components, and raising yield rates.
PF735-EP307 is halogen-free (REL0) and complies with RoHS. RoHS 2.0 and REACH. The no-clean paste is applicable to various surface finishes and has a clear flux residue. It is suitable for fine-pitch applications and various IC packages, such as system-in-package (SIP), wafer-level-package (WLP) and flip chip.
SHENMAO is dedicated to the production of solder products including Water Soluble and No-clean Solder Paste, Laser Solder Paste, Solder Preforms, Cored Solder Wire, Wave Solder Bar Alloys, Wave Soldering Fluxes, Extremely Pure Solder Powder up to Type 8, BGA and Micro BGA Solder Sphere, Wafer Level Packaging Solder Paste and Fluxes, LED Die Attach Paste, High Performance Liquid Fluxes, Solder Preform, Solar Ribbon, Plating Anode used in PCB Fabrication, Assembly and Semiconductor Packaging Processes.