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Home TECH ROOM SMT/PCB/EMS

SHENMAO Launches High-Performance Jet Dispensing Solder Paste

Nimish by Nimish
January 13, 2026
in SMT/PCB/EMS
Reading Time: 2 mins read
SHENMAO

SHENMAO Jetting Paste

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SAN JOSE, CA ― SHENMAO Technology, Inc. has introduced PF606-P266J, a high-performance solder paste engineered specifically for jet dispensing processes. Designed to meet the demands of next-generation, non-contact solder deposition, PF606-P266J delivers stable jetting performance, consistent droplet formation, and reliable solder joint quality under high-frequency dispensing conditions.

PF606-P266J features a halogen-free flux system that provides excellent wetting behavior, low residue, and strong solder joint reliability while supporting environmental compliance requirements. The formulation is optimized to perform consistently across a wide range of dispensing parameters, helping manufacturers maintain process stability and repeatability.

The solder paste is compatible with ultra-fine solder powders ranging from Type 5 to Type 7, with tightly controlled particle size distribution. This ensures smooth jetting behavior, minimizes the risk of nozzle clogging, and supports accurate, repeatable solder volume control for fine-feature applications.

To support a broad range of manufacturing requirements, PF606-P266J is available in multiple alloy options. In addition to PF606 (SAC305), the product can be supplied in high-reliability alloys suitable for automotive and industrial electronics, as well as low-temperature alloys designed to reduce reflow peak temperatures for heat-sensitive components and emerging substrates such as 3D printed circuit boards.

Typical applications include advanced SMT assembly, electronic module solder deposition, precision soldering for new product introduction (NPI) and prototyping, and soldering processes for 3D printed PCB assemblies.

By combining a halogen-free flux formulation, ultra-fine powder capability, and flexible alloy availability, PF606-P266J provides a reliable solution for advanced SMT, module assembly, and emerging electronics applications. The solder paste is engineered to support the evolving requirements of high-speed, high-precision jet dispensing in modern electronics manufacturing.

To learn more about SHENMAO’s high-performance solder materials, visit www.SHENMAO.com.

Tags: SHENMAOSolder Paste
Nimish

Nimish

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