SAN JOSE, CA ― SHENMAO America, Inc. is proud to highlight the benefits of its PF606-PW220 lead-free water-soluble solder paste. This innovative material is designed to meet the growing demand for reliable, easily cleanable soldering solutions in high-reliability PCBA (Printed Circuit Board Assembly) applications.
PF606-PW220 features a halogen-free (ORH0) formulation with no halogen intentionally added, ensuring compliance with global environmental regulations including RoHS, RoHS 2.0, and REACH. One of its most notable advantages is its ease of cleaning—residue can be effectively removed using only 60°C hot water, simplifying post-soldering processes and supporting cleaner, more sustainable manufacturing environments.
The solder paste also delivers outstanding voiding performance, excellent solderability, and high print consistency. These characteristics help improve yield and ensure strong, reliable joints across a wide range of surface finishes and component types. PF606-PW220 is particularly well-suited for surface mount and ground pad soldering in applications where low ionic residue and high-quality solder joints are critical, such as telecommunications, automotive electronics, industrial control systems, and medical devices.
“PF606-PW220 addresses the industry’s growing need for clean, lead-free solutions that also deliver top-tier performance,” said Watson Tseng, General Manager, SHENMAO. “Its ease of cleaning and outstanding void control make it an excellent choice for manufacturers focused on high reliability.”
For more information on SHENMAO’s PF925 solutions, visit www.SHENMAO.com.
